Abstract: A method for producing semiconductor chips includes preparing a semiconductor wafer having opposite front and rear surfaces and active semiconductor devices disposed in the semiconductor wafer at a part of the front surface, attaching a glass plate to the front surface of the semiconductor wafer, thinning the semiconductor wafer to a desired thickness from the rear surface, forming a first radiating layer over the rear surface of the semiconductor wafer, selectively forming a second radiating layer on the first radiating layer using, as a mask, a photoresist pattern covering portions of the first radiating layer opposite dicing regions, removing the semiconductor wafer from the glass plate, and cutting through the wafer and the first radiating layer with a dicing blade to produce a plurality of semiconductor chips. In this method, since the first radiating layer supports the thin wafer, the glass plate can be removed before the dicing process.