Patents by Inventor Sinichi Sekiya

Sinichi Sekiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5110543
    Abstract: A blade member for cutting-tools includes a cermet substrate which contains, apart from unavoidable impurities, a binder phase and a hard dispersed phase. The binder phase contains 5% to 30% by weight of cobalt and/or nickel. The hard dispersed phase contains a balance composite carbonitride of titanium and one or more of the elements tungsten, molybdenum, tantalum, niobium, hafnium and zirconium. The composite carbo-nitride satisfies the relationship 0.2.ltoreq.b/(a+b).ltoreq.0.7, where a and b denote atomic ratios of carbon and nitrogen, respectively. The substrate includes a hard surface layer in which the maximum hardness is present at a depth between 5 .mu.m and 50 .mu.m from a substrate surface thereof. The substrate surface has a hardness of 20% to 90% of the maximum hardness.
    Type: Grant
    Filed: July 19, 1991
    Date of Patent: May 5, 1992
    Assignee: Mitsubishi Metal Corporation
    Inventors: Niro Odani, Kazuyoshi Yoshioka, Sinichi Sekiya
  • Patent number: 5059491
    Abstract: A blade member for cutting-tools includes a cermet substrate which contains, apart from unavoidable impurities, a binder phase and a hard dispersed phase. The binder phase contains 5% to 30% by weight of cobalt and/or nickel. The hard dispersed phase contains a balance composite carbonitride of titanium and one or more of the elements tungsten, molybdenum, tantalum, niobium, hafnium and zirconium. The composite carbo-nitride satisfies the relationship 0.2.ltoreq.b/(a+b).ltoreq.0.7, where a and b denote atomic ratios of carbon and nitrogen, respectively. The substrate includes a hard surface layer in which the maximum hardness is present at a depth between 5 .mu.m and 50 .mu.m from a substrate surface thereof. The substrate surface has a hardness of 20% to 90% of the maximum hardness.
    Type: Grant
    Filed: November 9, 1989
    Date of Patent: October 22, 1991
    Assignee: Mitsubishi Metal Corporation
    Inventors: Niro Odani, Kazuyoshi Yoshioka, Sinichi Sekiya