Patents by Inventor Sinisa Likic

Sinisa Likic has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ACTIVATION OF VEHICLE CHARGING DEVICES FROM VEHICLE INTEGRATED CONTROLLER
    Publication number: 20220116067
    Abstract: A trainable transceiver comprises a transceiver circuit, a user interface, and a control circuit in selective communication with the transceiver circuit. The control circuit is further in communication with and configured to process inputs received at the user interface. The transceiver circuit is configured to, in response to a particular input received at the user interface, transmit an activation signal to a vehicle charging station.
    Type: Application
    Filed: October 8, 2021
    Publication date: April 14, 2022
    Applicant: GENTEX CORPORATION
    Inventors: Sinisa Likic, Christian Schubert, Klaus Weibler
  • Battery module housing and packaging
    Patent number: 10410452
    Abstract: A circuit assembly comprising a sealed interface is configured to isolate one or more electrical components. The assembly comprises a circuit board comprising a substrate and a cover comprising a polycarbonate material in connection with the substrate. The assembly further comprises an adhesive seal disposed around a perimeter surface of the cover. The adhesive seal comprises a UV curable adhesive having a chemical composition. The assembly further comprises a polyamide over-molded coating enclosing at least a portion of the circuit board and covering the adhesive seal.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: September 10, 2019
    Assignee: GENTEX CORPORATION
    Inventors: Joel A. Stray, Dennis E. Vilcans, Sinisa Likic, Derek S. Blaskowski, Thomas S. Wright, Jonathan M. Hansen, James S. Sheline
  • BATTERY MODULE HOUSING AND PACKAGING
    Publication number: 20180336750
    Abstract: A circuit assembly comprising a sealed interface is configured to isolate one of more electrical components. The assembly comprises a circuit board comprising a substrate and a cover comprising a polycarbonate material in connection with the substrate. The assembly further comprises an adhesive seal disposed around a perimeter surface of the cover. The adhesive seal comprises a UV curable adhesive having a chemical composition. The assembly further comprises a polyamide over-molded coating enclosing at least a portion of the circuit board and covering the adhesive seal.
    Type: Application
    Filed: April 25, 2018
    Publication date: November 22, 2018
    Applicant: Gentex Corporation
    Inventors: Joel A. Stray, Dennis E. Vilcans, Sinisa Likic, Derek S. Blaskowski, Thomas S. Wright, Jonathan M. Hansen, James S. Sheline