Abstract: An Al-based intermetallic compound in which a eutectic crystal type Al-CuMn intermetallic compound dispersion phase is dispersed in an Al-Cu intermetallic compound matrix phase. The content of Mn as a eutectic crystal-forming element contained in the dispersion phase is set in a range of from 5% by weight (inclusive) to 30% by weight (inclusive). In the course of solidification of the Al-Cu-Mn intermetallic compound, an infinite number of dispersion phases are first crystallized, and the matrix phase is then crystallized. This ensures that the matrix phase is formed into a fine crystal structure due to hindrance of the growth thereof by the dispersion phase, leading to increases in hardness and toughness of the resulting Al-based intermetallic compound. In another embodiment, the Al-based intermetallic compound contains peritectic type Al-based intermetallic dispersion phase, such as formed by Ta, dispersed in the intermetallic compound matrix phase.