Patents by Inventor Sintarou HAYASI

Sintarou HAYASI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light module
    Patent number: 8764209
    Abstract: A light module 1 includes a planar light emitting device 2, a wiring board 3, and an optical sheet 4. The wiring board 3 has a hole 8 for accommodating the planar light emitting device 2. The optical sheet 4 holds the planar light emitting device 2 and the wiring board 3 such that the planar light emitting device 2 accommodated in the hole 8 of the wiring board 3 and the wiring board 3 are flush with each other on the light emitting surface side of the light module 1. The optical sheet 4 holds the planar light emitting device 2 and the wiring board 3, and prevents dust and moisture from entering the inside the light module 1. This eliminates the necessity for the light module 1 to include a casing, packing, and the like. Therefore, the thickness of the module can be reduced.
    Type: Grant
    Filed: September 16, 2010
    Date of Patent: July 1, 2014
    Assignee: Panasonic Corporation
    Inventors: Sintarou Hayasi, Osamu Tanahasi, Satosi Fukano, Shinichi Anami, Shigetsugu Sumiyama, Motohiro Saimi, Hideharu Kawachi
  • LIGHT MODULE
    Publication number: 20110069495
    Abstract: A light module 1 includes a planar light emitting device 2, a wiring board 3, and an optical sheet 4. The wiring board 3 has a hole 8 for accommodating the planar light emitting device 2. The optical sheet 4 holds the planar light emitting device 2 and the wiring board 3 such that the planar light emitting device 2 accommodated in the hole 8 of the wiring board 3 and the wiring board 3 are flush with each other on the light emitting surface side of the light module 1. The optical sheet 4 holds the planar light emitting device 2 and the wiring board 3, and prevents dust and moisture from entering the inside the light module 1. This eliminates the necessity for the light module 1 to include a casing, packing, and the like. Therefore, the thickness of the module can be reduced.
    Type: Application
    Filed: September 16, 2010
    Publication date: March 24, 2011
    Applicant: PANASONIC ELECTRIC WORKS CO., LTD.
    Inventors: Sintarou HAYASI, Osamu TANAHASI, Satosi FUKANO, Shinichi ANAMI, Shigetsugu SUMIYAMA, Motohiro SAIMI, Hideharu KAWACHI