Patents by Inventor Siou-Yi Hong

Siou-Yi Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080085629
    Abstract: The present invention provides an improved connector structure in which a connector is structured from a conducting body, electric conducting terminals and fastening members, wherein terminals, which electrically connect with a circuit and connecting terminals, are disposed interior of the conducting body. The fastening members extend from the conducting body, and the fastening members enable the conducting body to embed into a circuit board, thereby enabling the connector to fasten into corresponding holes of the circuit board by means of the fastening members, and thus achieve the objective of increasing positioning strength.
    Type: Application
    Filed: October 6, 2006
    Publication date: April 10, 2008
    Inventors: Siou-Yi Hong, Lun-Ting Liu
  • Patent number: 7311527
    Abstract: A connector structure includes a connector structured from a cover casing, an insulating body, signal terminals and staggered terminals. The insulating body is disposed within the cover casing, and connecting portions and soldering portions extend from the cover casing. Moreover, a containing space is defined within the insulating body. Ribs having a guide positioning function are disposed within the containing space, and clasp grooves that fixedly hold staggered terminals, second passages and first passages having signal terminals penetrate therethrough are located within the insulating body. Each of the staggered terminals includes a pressure terminal and an earth terminal, which are in an up/down and right/left juxtaposed configuration. Electric conduction portions of the signal terminals enable electrical connection with a circuit board, thereby enabling the connector to achieve the objective of electrical conduction, and increase electrical conduction efficiency and reduce manufacturing cost.
    Type: Grant
    Filed: October 13, 2006
    Date of Patent: December 25, 2007
    Assignee: Singatron Enterprise Co., Ltd.
    Inventors: Siou-Yi Hong, Lun-Ting Liu