Abstract: The present invention relates to an apparatus for burn-in of a device under test (4), characterized by: a thermal conductive plate (2) including a cooling channel (3) for allowing passage of a cooling medium for regulating temperature of the thermal conductive plate (2); the device under test (4) placed on the thermal conductive plate (2); a pressure chamber (5) engaged to the device under test (4), comprising a hollow housing (6) including an integrated cooling passage (7), an air inlet (8), a seal (9) and air outlet (10) aid in regulating temperature of said pressure chamber; and a pin guide means comprising an upper guide (11) embedded in the thermal conductive plate (2) and a lower guide (12) for guiding movement of the pogo pin (13) and its connection with the device under test (4).

Abstract: The present invention relates to an apparatus for burn-in of a device under test (4), characterized by: a thermal conductive plate (2) including a cooling channel (3) for allowing passage of a cooling medium for regulating temperature of the thermal conductive plate (2); the device under test (4) placed on the thermal conductive plate (2); a pressure chamber (5) engaged to the device under test (4), comprising a hollow housing (6) including an integrated cooling passage (7), an air inlet (8), a seal (9) and air outlet (10) aid in regulating temperature of said pressure chamber; and a pin guide means comprising an upper guide (11) embedded in the thermal conductive plate (2) and a lower guide (12) for guiding movement of the pogo pin (13) and its connection with the device under test (4).