Patents by Inventor Siping Zhang

Siping Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250224290
    Abstract: Provided is a method for measuring residual stress in a thin plate. The method includes: S1: prearranging and cutting a plurality of fins, computing x-direction strain ?i0 and x-direction residual stress ?i0 in the length direction of the thin plate borne by each fin, and obtaining distribution of x-direction residual stress in the width direction of the thin plate according to all ?i0; S2: repeatedly cutting the fixed ends in a thickness direction of the thin plate, computing a total cutting depth Zij and x-direction residual stress ?ij of each fin after each cutting, and obtaining distribution of x-direction residual stress in the thickness direction of the thin plate borne by an ith fin according to all ?ij; and S3: computing distribution ?x, ?x=?i0+?ij, of x-direction residual stress on a yz cross section of the thin plate according to ?i0 obtained in S1 and corresponding ?ij in S2.
    Type: Application
    Filed: July 4, 2023
    Publication date: July 10, 2025
    Inventors: Junqiang WANG, Hailong CAO, Cheng LIU, Guojun WANG, Dongnan HUANG, Wei LI, Fuguan CONG, Xueguang DONG, Siping ZHANG, Haiyun LUO, Mingdong HUANG, Kai LI, Yibin REN, Xiaoyu SONG, Qing LI
  • Patent number: D980923
    Type: Grant
    Filed: January 13, 2022
    Date of Patent: March 14, 2023
    Inventor: Siping Zhang
  • Patent number: D982672
    Type: Grant
    Filed: December 5, 2022
    Date of Patent: April 4, 2023
    Inventor: Siping Zhang