Patents by Inventor Siqi Zhang

Siqi Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12157769
    Abstract: The present disclosure provides a virus composition. The efficacy of a variety of virus compositions loaded with different functional genes was detected, and several virus compositions with excellent antitumor effect were confirmed.
    Type: Grant
    Filed: October 18, 2022
    Date of Patent: December 3, 2024
    Assignee: BINHUI BIOPHARMACEUTICAL CO., LTD.
    Inventors: Binlei Liu, Linkang Cai, Runyang Wang, Siqi Zhang, Han Hu
  • Publication number: 20240272615
    Abstract: The present disclosure discloses a system and a method for controlling an operation of a machine including at least one actuator. The method comprises obtaining a time period of an operation of the at least one actuator, collecting an energy level of the at least one actuator, and determining one or more hyperparameters of a time bound function such that a value of the time bound function is greater than or equal to the time period of the operation of the at least one actuator. The method further comprises solving an optimal control problem optimizing a cost function of the operation of the at least one actuator using an adaptive gradient descent method that is initialized with the collected energy level and a constant defined based on the one or more hyperparameters and controlling the at least one actuator based on a solution of the optimal control problem.
    Type: Application
    Filed: February 9, 2023
    Publication date: August 15, 2024
    Inventors: Mouhacine Benosman, Siqi Zhang
  • Publication number: 20240208861
    Abstract: A low-cost four-element system cementitious material, a preparation method and an application thereof are provided by the present disclosure, and the cementitious material is used in the fields of mine cementing filling and building materials. The four-element system cementitious material includes the following raw materials in percentage by mass: 20-60% of water-quenched blast furnace slag, 10-40% of waste incineration bottom ash, 20% of pretreated waste incineration fly ash and the balance of desulfurization gypsum. The low-cost four-element system cementitious material is used to replace cement to prepare mine cementing filling materials, and is also used to prepare concrete materials for construction industry.
    Type: Application
    Filed: December 20, 2023
    Publication date: June 27, 2024
    Inventors: Siqi ZHANG, Tong ZHAO, Huifen YANG, Wen NI, Zeping WU, Yue LI, Jia LI, Keqing LI, Pingfeng FU, Yunyun LI, Xiang CHEN, Yuhang LIU, Dongshang GUAN, Jiajia WANG, Qiwei SUN
  • Patent number: 11928957
    Abstract: An audio visual haptic signal reconstruction method includes first utilizing a large-scale audio-visual database stored in a central cloud to learn knowledge, and transferring same to an edge node; then combining, by means of the edge node, a received audio-visual signal with knowledge in the central cloud, and fully mining semantic correlation and consistency between modals; and finally fusing the semantic features of the obtained audio and video signals and inputting the semantic features to a haptic generation network, thereby realizing the reconstruction of the haptic signal. The method effectively solves the problems that the number of audio and video signals of a multi-modal dataset is insufficient, and semantic tags cannot be added to all the audio-visual signals in a training dataset by means of manual annotation. Also, the semantic association between heterogeneous data of different modals are better mined, and the heterogeneity gap between modals are eliminated.
    Type: Grant
    Filed: July 1, 2022
    Date of Patent: March 12, 2024
    Assignee: NANJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS
    Inventors: Xin Wei, Liang Zhou, Yingying Shi, Zhe Zhang, Siqi Zhang
  • Publication number: 20230290234
    Abstract: An audio visual haptic signal reconstruction method includes first utilizing a large-scale audio-visual database stored in a central cloud to learn knowledge, and transferring same to an edge node; then combining, by means of the edge node, a received audio-visual signal with knowledge in the central cloud, and fully mining semantic correlation and consistency between modals; and finally fusing the semantic features of the obtained audio and video signals and inputting the semantic features to a haptic generation network, thereby realizing the reconstruction of the haptic signal. The method effectively solves the problems that the number of audio and video signals of a multi-modal dataset is insufficient, and semantic tags cannot be added to all the audio-visual signals in a training dataset by means of manual annotation. Also, the semantic association between heterogeneous data of different modals are better mined, and the heterogeneity gap between modals are eliminated.
    Type: Application
    Filed: July 1, 2022
    Publication date: September 14, 2023
    Inventors: Xin WEI, Liang ZHOU, Yingying SHI, Zhe ZHANG, Siqi ZHANG
  • Publication number: 20230192852
    Abstract: The present disclosure provides a virus composition. The efficacy of a variety of virus compositions loaded with different functional genes was detected, and several virus compositions with excellent antitumor effect were confirmed.
    Type: Application
    Filed: October 18, 2022
    Publication date: June 22, 2023
    Inventors: BINLEI LIU, Linkang Cai, Runyang Wang, Siqi Zhang, Han Hu
  • Publication number: 20230088338
    Abstract: Generation and use of a focus quality metric that is intensity independent is described. In one example, the focus quality metric is generated by acquiring an image, such as an image of a patterned surface of a flow cell, and processing all or part (e.g., a sub-region or sub-image) to generate a Fourier transform of the respective image data. By way of example, in one embodiment a discrete Fourier transform may be applied to a sub-region of an image of a patterned flow cell surface. A focus quality metric that is intensity independent may be derived from the Fourier transform of the image data.
    Type: Application
    Filed: September 8, 2022
    Publication date: March 23, 2023
    Inventors: Thomas Baker, Kevin Early, Siqi Zhang, Rachel Abaskharon, Anmiv Prabhu, Patrick Wen
  • Patent number: 11552040
    Abstract: A method is disclosed herein. The method includes dicing a wafer and applying a mask. The method includes spraying die bond material, at a first temperature, to a surface of the wafer and cooling the die bond material at a second temperature to at least partially solidify the die bond material. The method also includes removing the mask from the wafer through the die bond material. After the removing of the mask, the method includes curing the die bond material to form a die attach film layer on the wafer.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: January 10, 2023
    Assignee: Western Digital Technologies, Inc.
    Inventors: Siqi Zhang, Xu Wang, Pradeep Rai, Shrikar Bhagath
  • Publication number: 20220406695
    Abstract: A semiconductor device package includes a semiconductor device with a ball grid array having a first subset of solder balls composed of metallic solder, and a second subset of solder balls composed of a composite material that includes a polymer core surrounded by a solder layer. The solder balls of the second subset can have a lower elastic modulus than the solder balls of the first subset and resist cracking due to thermal stresses on the semiconductor device package. In one embodiment, at least a portion of the second subset of solder balls is located on the periphery of the ball grid array such that the first subset of solder balls may be surrounded, at least partially, by the second subset of solder balls.
    Type: Application
    Filed: June 22, 2021
    Publication date: December 22, 2022
    Applicant: Western Digital Technologies, Inc.
    Inventors: Siqi Zhang, Xu Wang, Wei Wang, Yangming Liu, Pradeep Rai
  • Patent number: 11505607
    Abstract: The present disclosure provides a bispecific single-chain antibody, recombinant oncolytic virus for expressing same and virus composition. The antibody named BiTEs-PD-L1 is a bispecific antibody capable of simultaneously binding CD3 and PD-L1 on the surfaces of tumor cells, and it can effectively activate T cells and guide T cells to kill tumor cells. The oncolytic virus oHSV2-BiTEs-PD-L1 is further developed by utilizing the BiTEs-PD-L1, it can reduce frequency and dosage of the administration. The present disclosure also confirmed several virus compositions with excellent antitumor effect.
    Type: Grant
    Filed: January 5, 2022
    Date of Patent: November 22, 2022
    Assignee: BINHUI BIOPHARMACEUTICAL CO., LTD.
    Inventors: Binlei Liu, Linkang Cai, Runyang Wang, Siqi Zhang, Han Hu
  • Publication number: 20220153843
    Abstract: The present disclosure provides a bispecific single-chain antibody, recombinant oncolytic virus for expressing same and virus composition. The antibody named BiTEs-PD-L1 is a bispecific antibody capable of simultaneously binding CD3 and PD-L1 on the surfaces of tumor cells, and it can effectively activate T cells and guide T cells to kill tumor cells. The oncolytic virus oHSV2-BiTEs-PD-L1 is further developed by utilizing the BiTEs-PD-L1, it can reduce frequency and dosage of the administration. The present disclosure also confirmed several virus compositions with excellent antitumor effect.
    Type: Application
    Filed: January 5, 2022
    Publication date: May 19, 2022
    Inventors: BINLEI LIU, Linkang Cai, Runyang Wang, Siqi Zhang, Han Hu
  • Publication number: 20220028819
    Abstract: A method is disclosed herein. The method includes dicing a wafer and applying a mask. The method includes spraying die bond material, at a first temperature, to a surface of the wafer and cooling the die bond material at a second temperature to at least partially solidify the die bond material. The method also includes removing the mask from the wafer through the die bond material. After the removing of the mask, the method includes curing the die bond material to form a die attach film layer on the wafer.
    Type: Application
    Filed: July 21, 2020
    Publication date: January 27, 2022
    Applicant: Western Digital Technologies, Inc.
    Inventors: Siqi ZHANG, Xu WANG, Pradeep RAI, Shrikar BHAGATH
  • Patent number: 11028464
    Abstract: The present invention provides a lead-free easy-to-cut corrosion-resistant brass alloy with good thermoforming performance. The brass alloy contains: 74.5-76.5 wt % of Cu, 3.0-3.5 wt % of Si, 0.11-0.2 wt % of Fe, 0.04-0.10% wt % of P, Zn and inevitable impurities. The alloy provided by the present invention has good cold-working and hot-working forming performance, and good dezincification corrosion-resistant and stress corrosion-resistant performance, applies to parts that require cutting and grinding forming in water-heating sanitaryware, electronic appliances, automobiles and the like, and especially applies to production and assembling of complex forging products for which stress is inconvenient to eliminate, such as water taps, values and the like.
    Type: Grant
    Filed: January 24, 2014
    Date of Patent: June 8, 2021
    Assignee: XIAMEN LOTA INTERNATIONAL CO., LTD.
    Inventors: Chuankai Xu, Zhenqing Hu, Nianrun Zhou, Siqi Zhang, Jia Long, Huawei Zhang
  • Publication number: 20200209223
    Abstract: A high throughput system and method for analyzing the effects of a plurality of agents on planaria is disclosed. Multiple test zones are provided, where each test zone contains at least a portion of one planarian. The planaria in each test zone are then exposed to at least one agent, the test zones are sealed, and at various times, the test zones are moved automatically between a storage location and at least one assay station. At each assay station, the test zones are exposed to a set of conditions, and an image or video of the planaria in the test zones are captured. Automated image or video analysis is used to are evaluate and determine whether the agent has an effect.
    Type: Application
    Filed: January 2, 2019
    Publication date: July 2, 2020
    Inventors: Eva-Maria S. Collins, Danielle Ireland, Siqi Zhang
  • Publication number: 20160068931
    Abstract: The present invention provides a lead-free easy-to-cut corrosion-resistant brass alloy with good thermoforming performance. The brass alloy contains: 74.5-76.5 wt % of Cu, 3.0-3.5 wt % of Si, 0.11-0.2 wt % of Fe, 0.04-0.10% wt % of P, Zn and inevitable impurities. The alloy provided by the present invention has good cold-working and hot-working forming performance, and good dezincification corrosion-resistant and stress corrosion-resistant performance, applies to parts that require cutting and grinding forming in water-heating sanitaryware, electronic appliances, automobiles and the like, and especially applies to production and assembling of complex forging products for which stress is inconvenient to eliminate, such as water taps, values and the like.
    Type: Application
    Filed: January 24, 2014
    Publication date: March 10, 2016
    Inventors: Chuankai XU, Zhenqing HU, Nianrun ZHOU, Siqi ZHANG, Jia LONG, Huawei ZHANG
  • Patent number: 8580191
    Abstract: The present invention relates to a brass alloy having superior stress corrosion comprising: 59.0-64.0 wt % Cu, 0.6-1.2 wt % Fe, 0.6-1.0 wt % Mn, 0.4-1.0 wt % Bi, 0.6-1.4 wt % Sn, at least one element selected from Al, Cr and B, the balance being Zn and unavoidable impurities, wherein the content of Al is 0.1-0.8 wt %, the content of Cr is 0.01-0.1 wt %, the content of B is 0.001-0.02 wt %. The alloy according to the present invention does not contain toxic elements such as lead and antimony, has superior corrosion resistance and good cuttingability and is suitable for the accessories in the potable water supply systems produced by casting, forging and extruding.
    Type: Grant
    Filed: December 9, 2010
    Date of Patent: November 12, 2013
    Assignee: Xiamen Lota International Co., Ltd.
    Inventors: Chuankai Xu, Zhenqing Hu, Siqi Zhang
  • Patent number: 8568656
    Abstract: The present invention provides an environment-friendly manganese brass alloy, which comprises 55˜65 wt % of Cu, 1.0˜6.5 wt % of Mn, 0.2˜3.0 wt % of Al, 0˜3.0 wt % of Fe, 0.3˜2.0 wt % of Sn, 0.01˜0.3 wt % of Mg, 0˜0.3 wt % of Bi and/or 0˜0.2 wt % of Pb, the balance being Zn and unavoidable impurities. The alloys not only have superior mechanical properties, castability, cutability and corrosion resistance, especially stress corrosion resistance properties, but also have the advantages of low manufacturing costs and simple manufacturing process etc, which is suitable for making components through forging, casting, cutting and other manufacturing methods, especially suitable for making water tap bodies and valves through forging, casting and cutting processes.
    Type: Grant
    Filed: March 2, 2011
    Date of Patent: October 29, 2013
    Assignee: Xiamen Lota International Co., Ltd.
    Inventors: Zhenqing Hu, Chuankai Xu, Qing Lv, Nianrun Zhou, Jia Long, Siqi Zhang
  • Patent number: 8425697
    Abstract: A tin-free lead-free free-cutting magnesium brass alloy contains 56.0 to 64.0 wt % Cu, 1.05 to about 2.1 wt % Mg, 0.21 to 0.4 wt % P and other elements 0.002 to 0.9 wt % which contain at least two elements selected from Al, Si, Sb, rare earth elements, Ti and B and the balance being Zn with unavoidable impurities, accordingly a cutting percentage of the alloy is at least 80%. The process for producing such alloy is also proposed. The invented alloy is excellent in cuttability, castability, hot and cold workability, corrosion resistance, mechanical properties and weldability and particularly applicable in spare parts, forging and casting which need cutting and grinding process. The cost of necessary metal materials of the invented alloy is lower than lead-free free-cutting bismuth and antimony brass alloy and is equivalent to lead-contained brass alloy.
    Type: Grant
    Filed: December 4, 2009
    Date of Patent: April 23, 2013
    Assignee: Xiamen Lota International Co., Ltd.
    Inventors: Chuankai Xu, Zhenqing Hu, Siqi Zhang
  • Patent number: 8273193
    Abstract: The present invention supplies a lead-free, bismuth-free free-cutting silicon brass alloy with high zinc which preferably comprises 35.0 to 42.0 wt % Zn, 0.1 to 1.5 wt % Si, 0.03 to 0.3 wt % Al, 0.01 to 0.36 wt % P, 0.01 to 0.1 wt % Ti, 0.001 to 0.05 wt % rare earth metals selected from the group consisting of La and Ce, 0.05 to 0.5 wt % Sn, and/or 0.05 to 0.2 wt % Ni, and the balance being Cu and unavoidable impurities. In yet another embodiment, the alloy may be boron-free. The invented alloy is excellent in castability, weldability, cuttability, electroplating properties, corrosion resistance, mechanical properties. The alloy is especially applicable in castings which need cutting and welding under low pressure die casting, such as castings for faucet bodies in the water supply system. The alloy is also suitable for use in components which are produced from casting ingots by die forging.
    Type: Grant
    Filed: January 4, 2010
    Date of Patent: September 25, 2012
    Assignee: Xiamen Lota International Co., Ltd.
    Inventors: Chankai Xu, Zhenqing Hu, Siqi Zhang
  • Patent number: D850747
    Type: Grant
    Filed: December 25, 2017
    Date of Patent: June 4, 2019
    Inventors: Jing Zhang, Siqi Zhang