Abstract: The present disclosure generally relates to die-package interconnect in a semiconductor device assembly to facilitate thermal conduction. In an example, a semiconductor device assembly includes a semiconductor substrate, a metallization structure, a package substrate, a die-package interconnect, and one or more insulation layers. The metallization structure is on the semiconductor substrate and includes a first metal layer. The die-package interconnect is between the metallization structure and a second metal layer of the package substrate. The die-package interconnect overlaps at least part of a transistor on the semiconductor substrate. The insulation layer(s) are on the metallization structure and have a first portion having a first thickness and a second portion having a second thickness. The first portion is outside a footprint of the transistor. The second portion is between the die-package interconnect and the at least part of the transistor. The first thickness being larger than the second thickness.

Abstract: In an example apparatus, a first transistor has a base terminal, a first current terminal and a second current terminal. The base terminal is coupled to an input voltage node. A second transistor has a control terminal, a third current terminal and a fourth current terminal. The third current terminal is coupled to the second current terminal. The fourth current terminal is coupled to a first resistor. A second resistor is coupled to the control terminal. An inductor is coupled between the first resistor and a ground terminal.

Abstract: An integrated circuit includes a semiconductor die, a package substrate having opposite first and second surfaces, where the first surface includes a first metal pad, the second surface includes a second metal pad and a third metal pad. The semiconductor die is mounted on the second metal pad and the third metal pad by respective first and second metal interconnects. The package substrate includes a circuit with a single-ended terminal and a pair of differential terminals, where the single-ended terminal coupled to the first metal pad. The backage substrate also includes a metal layer including a first meandered conductor and a second meandered conductor. The first meandered conductor is coupled between a first terminal of the pair of differential terminals and the second metal pad. The second meandered conductor is coupled between a second terminal of the pair of differential terminals and the third metal pad.

Abstract: An electronic device includes a multilevel package substrate, a semiconductor die, and a package structure, the multilevel package substrate having a first level, a second level, and a filter circuit in the first and second levels. The filter circuit includes a filter input terminal, a first capacitor, a first inductor, a second capacitor, a second inductor, a filter output terminal, and a reference terminal. The semiconductor die is attached to the multilevel package substrate and has a conductive structure coupled to one of the terminals of the filter circuit, and the package structure encloses the semiconductor die and a portion of the multilevel package substrate.

Abstract: In examples, a semiconductor package comprises a conductive terminal; a semiconductor die including a device side having circuitry formed therein, the device side facing toward the conductive terminal; and a substrate coupled to the conductive terminal and to the device side of the semiconductor die. The substrate includes a first metal layer coupled to first and second vias extending toward and coupled to either the device side of the semiconductor die or the conductive terminal. The substrate includes a second metal layer electrically isolated from the first metal layer by an insulation layer between the first and second metal layers, the second metal layer coupled to a third via extending toward and coupled to either the conductive terminal or the semiconductor die. The first and second metal layers form a Marchand balun.

Abstract: An example apparatus includes: an on-off keying (OOK) modulator including: a first transistor including a first control terminal; a second transistor including a first current terminal, a second current terminal, and a second control terminal, the first current terminal coupled to the first control terminal; a third transistor including a third current terminal, a fourth current terminal, and a third control terminal, the third current terminal coupled to the first control terminal; a fourth transistor including a fifth current terminal, the fifth current terminal coupled to the second current terminal; and a fifth transistor including a sixth current terminal, the sixth current terminal coupled to the fourth current terminal.

Abstract: An example apparatus includes: an on-off keying (OOK) modulator including: a first transistor including a first control terminal; a second transistor including a first current terminal, a second current terminal, and a second control terminal, the first current terminal coupled to the first control terminal; a third transistor including a third current terminal, a fourth current terminal, and a third control terminal, the third current terminal coupled to the first control terminal; a fourth transistor including a fifth current terminal, the fifth current terminal coupled to the second current terminal; and a fifth transistor including a sixth current terminal, the sixth current terminal coupled to the fourth current terminal.

Abstract: Power efficient receiver architectures are described. A receiver includes a first receiver path having a low power consumption compared to a second receiver path with a higher power consumption but a better ability to remove blocking signals. A multiplexer at the output of both receiver paths is used to select the digital bit stream from either the first path or the second path based on whichever path is currently enabled. The first receiver path can be enabled by default until a blocker signal is detected or the received data is invalid. At such an instance, the first receiver path is disabled and the second receiver path is enabled to remove the blocker and read out the data. The second receiver path may then continue to be enabled for a particular number of pings before switching the output back to the first receiver path.

Abstract: In described examples, an integrated circuit includes an on-off keying (OOK) digital isolator, which includes a first circuitry, a multiplexer, an OOK modulator, an isolation barrier, an OOK envelope detector, and a second circuitry. The first circuitry generates and outputs a calibration signal. The multiplexer has a data signal input, and an input coupled to a first circuitry output. An OOK modulator input is coupled to a multiplexer output. An isolation barrier input is coupled to an OOK modulator output. An OOK envelope detector input is coupled to an isolation barrier output. The second circuitry includes an input coupled to an OOK envelope detector output, and an output coupled to an OOK envelope detector control input. The second circuitry detects a duty cycle distortion (DCD) of the OOK envelope detector output, and outputs a control signal to change the OOK envelope detector output's duty cycle based on the detected DCD.

Abstract: A circuit includes a main amplifier having a first input and a first output. A main bias circuit is coupled to the main amplifier, and the main bias circuit configured to operate the main amplifier in a first frequency band. A feedforward cancellation amplifier has a second input and a second output, in which the second input is coupled to the first input, and the second output is coupled to the first output. A filter is coupled between the first input and the second input. A feedforward bias circuit is coupled to the feedforward cancellation amplifier. The feedforward bias circuit is configured to operate the feedforward cancellation amplifier in a second frequency band within and narrower than the first frequency band.

Abstract: In one example, an apparatus comprises: a first metal layer including a first segment and a second segment, in which the first segment is electrically coupled to a single-ended signal terminal, the second segment has a disconnected end; a second metal layer including a third segment and a fourth segment, in which the third segment is magnetically coupled to the first segment, the fourth segment is magnetically coupled to the second segment, a first end of the third segment and a first end of the fourth segment are electrically coupled at a center tap, and a second end of the third segment and a second end of the fourth segment are electrically coupled to respective first and second signal terminals of a pair of differential signal terminals; and a phase adjustment device proximate the center tap and electrically coupled to a second voltage reference terminal.

Abstract: In described examples, an integrated circuit includes an on-off keying (OOK) digital isolator, which includes a first circuitry, a multiplexer, an OOK modulator, an isolation barrier, an OOK envelope detector, and a second circuitry. The first circuitry generates and outputs a calibration signal. The multiplexer has a data signal input, and an input coupled to a first circuitry output. An OOK modulator input is coupled to a multiplexer output. An isolation barrier input is coupled to an OOK modulator output. An OOK envelope detector input is coupled to an isolation barrier output. The second circuitry includes an input coupled to an OOK envelope detector output, and an output coupled to an OOK envelope detector control input. The second circuitry detects a duty cycle distortion (DCD) of the OOK envelope detector output, and outputs a control signal to change the OOK envelope detector output's duty cycle based on the detected DCD.

Abstract: A circuit includes a main amplifier having a first input and a first output. A main bias circuit is coupled to the main amplifier, and the main bias circuit configured to operate the main amplifier in a first frequency band. A feedforward cancellation amplifier has a second input and a second output, in which the second input is coupled to the first input, and the second output is coupled to the first output. A filter is coupled between the first input and the second input. A feedforward bias circuit is coupled to the feedforward cancellation amplifier. The feedforward bias circuit is configured to operate the feedforward cancellation amplifier in a second frequency band within and narrower than the first frequency band.

Abstract: In described examples, a method of operating a charge pump includes a first control signal deactivating a first transistor, and the first control signal's logical complement activating a second transistor to reset the first transistor's DC bias voltage. The first control signal's logical complement deactivates the second transistor, and the first control signal provides a bias voltage to the first transistor to activate it, causing current to be transmitted from an input voltage to an output terminal. A second control signal deactivates a third transistor, and the second control signal's logical complement activates a fourth transistor to reset the second transistor's DC bias voltage. The second control signal's logical complement deactivates the fourth transistor, and the second control signal provides a bias voltage to the third transistor to activate it, causing current to be transmitted from the output terminal to a ground.

Abstract: In described examples, a method of operating a transceiver with a transmitter and a receiver includes generating a frequency reference. In the transmitter: A phase locked loop (PLL) generates a first voltage controlled oscillator (VCO) control voltage responsive to the frequency reference. A VCO in the transmitter generates a transmitter VCO signal responsive to the first VCO control voltage, and the PLL is locked to the transmitter VCO signal. In the receiver: A signal is received. A receiver VCO generates a receiver VCO signal responsive to the first or a second VCO control voltage. The receiver VCO signal is multiplied by the received signal to generate an I component, and by the received signal phase shifted by 90° to generate a Q component. The second VCO control signal is generated responsive to the I component and the Q component.

Abstract: Embodiments of the invention provide a system and method for chip to chip communications in electronic circuits. In one embodiment, a networking device includes an input port circuit having a transmitter circuit coupled one or more transmitter antennas, wherein the input port circuit transmits a data packet to a first output port circuit using millimeter wave signals. The networking device includes output port circuits including at least the first output port circuit, each of the output port circuits having a receiver circuit coupled to one or more receiver antennas. The networking device includes a beamforming circuit coupled to the one or more transmitter antennas of the input port circuit, wherein the beamforming circuit causes the one or more transmitter antennas to transmit an antenna beam directed at the one or more receiver antennas of the first output port circuit.

Abstract: In described examples, a method of operating a charge pump includes a first control signal deactivating a first transistor, and the first control signal's logical complement activating a second transistor to reset the first transistor's DC bias voltage. The first control signal's logical complement deactivates the second transistor, and the first control signal provides a bias voltage to the first transistor to activate it, causing current to be transmitted from an input voltage to an output terminal. A second control signal deactivates a third transistor, and the second control signal's logical complement activates a fourth transistor to reset the second transistor's DC bias voltage. The second control signal's logical complement deactivates the fourth transistor, and the second control signal provides a bias voltage to the third transistor to activate it, causing current to be transmitted from the output terminal to a ground.

Abstract: Methods, apparatus, systems and articles of manufacture are disclosed to provide phase imbalance correction. An example system includes a phase detector to obtain a first signal and generate a first output, a comparator coupled to the phase detector, the comparator to generate a second output based on the first output, and an amplifier coupled to the comparator, the amplifier to adjust a first phase response of the first signal based on the second output.

Abstract: In described examples, a method of operating a charge pump includes a first control signal deactivating a first transistor, and the first control signal's logical complement activating a second transistor to reset the first transistor's DC bias voltage. The first control signal's logical complement deactivates the second transistor, and the first control signal provides a bias voltage to the first transistor to activate it, causing current to be transmitted from an input voltage to an output terminal. A second control signal deactivates a third transistor, and the second control signal's logical complement activates a fourth transistor to reset the second transistor's DC bias voltage. The second control signal's logical complement deactivates the fourth transistor, and the second control signal provides a bias voltage to the third transistor to activate it, causing current to be transmitted from the output terminal to a ground.

Abstract: In described examples, a method of operating a transceiver with a transmitter and a receiver includes generating a frequency reference. In the transmitter: A phase locked loop (PLL) generates a first voltage controlled oscillator (VCO) control voltage responsive to the frequency reference. A VCO in the transmitter generates a transmitter VCO signal responsive to the first VCO control voltage, and the PLL is locked to the transmitter VCO signal. In the receiver: A signal is received. A receiver VCO generates a receiver VCO signal responsive to the first or a second VCO control voltage. The receiver VCO signal is multiplied by the received signal to generate an I component, and by the received signal phase shifted by 90° to generate a Q component. The second VCO control signal is generated responsive to the I component and the Q component.