Patents by Inventor Siti Nurulhaida Bt. RAMLAN

Siti Nurulhaida Bt. RAMLAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame support plate and window clamp for wire bonding machines
    Patent number: 9070762
    Abstract: A lead frame support plate 200 and a window clamp 400 for wire bonding machines are disclosed herein. In a described embodiment, the lead frame support plate 200 includes a network of suction grooves 218 provided on a support surface 212, each suction groove 218 being arranged to be in fluid communication with at least a vacuum hole 216 to enable a suction force to be created, in response to a vacuum force, along the network of suction grooves for holding a lead frame against the support surface. A window clamp 400 having slots for compensating deformation of the window clamp and a method of fabricating the lead frame support plate are also disclosed.
    Type: Grant
    Filed: April 7, 2014
    Date of Patent: June 30, 2015
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Phui Phoong Chuang, Hasrul Bin Hasim, Wan Azmi, Siti Nurulhaida Bt. Ramlan, Ka Shing Kwan, Ting Yu He, Jun Wan
  • LEAD FRAME SUPPORT PLATE AND WINDOW CLAMP FOR WIRE BONDING MACHINES
    Publication number: 20140217152
    Abstract: A lead frame support plate 200 and a window clamp 400 for wire bonding machines are disclosed herein. In a described embodiment, the lead frame support plate 200 includes a network of suction grooves 218 provided on a support surface 212, each suction groove 218 being arranged to be in fluid communication with at least a vacuum hole 216 to enable a suction force to be created, in response to a vacuum force, along the network of suction grooves for holding a lead frame against the support surface. A window clamp 400 having slots for compensating deformation of the window clamp and a method of fabricating the lead frame support plate are also disclosed.
    Type: Application
    Filed: April 7, 2014
    Publication date: August 7, 2014
    Inventors: Phui Phoong CHUANG, Hasrul Bin HASIM, Wan AZMI, Siti Nurulhaida Bt. RAMLAN, Ka Shing KWAN, Ting Yu HE, Jun WAN
  • Lead frame support plate and window clamp for wire bonding machines
    Patent number: 8752751
    Abstract: A lead frame support plate 200 and a window clamp 400 for wire bonding machines are disclosed herein. In a described embodiment, the lead frame support plate 200 includes a network of suction grooves 218 provided on a support surface 212, each suction groove 218 being arranged to be in fluid communication with at least a vacuum hole 216 to enable a suction force to be created, in response to a vacuum force, along the network of suction grooves for holding a lead frame against the support surface. A window clamp 400 having slots for compensating deformation of the window clamp and a method of fabricating the lead frame support plate are also disclosed.
    Type: Grant
    Filed: July 13, 2012
    Date of Patent: June 17, 2014
    Assignee: ASM Technology Singapore Pte Ltd
    Inventors: Phui Phoong Chuang, Hasrul Bin Hasim, Wan Azmi, Siti Nurulhaida Bt. Ramlan, Ka Shing Kwan, Ting Yu He, Jun Wan
  • LEAD FRAME SUPPORT PLATE AND WINDOW CLAMP FOR WIRE BONDING MACHINES
    Publication number: 20140014708
    Abstract: A lead frame support plate 200 and a window clamp 400 for wire bonding machines are disclosed herein. In a described embodiment, the lead frame support plate 200 includes a network of suction grooves 218 provided on a support surface 212, each suction groove 218 being arranged to be in fluid communication with at least a vacuum hole 216 to enable a suction force to be created, in response to a vacuum force, along the network of suction grooves for holding a lead frame against the support surface. A window clamp 400 having slots for compensating deformation of the window clamp and a method of fabricating the lead frame support plate are also disclosed.
    Type: Application
    Filed: July 13, 2012
    Publication date: January 16, 2014
    Inventors: Phui Phoong CHUANG, Hasrul Bin HASIM, Wan AZMI, Siti Nurulhaida Bt. RAMLAN, Ka Shing KWAN, Ting Yu HE, Jun WAN