Abstract: A system and method are disclosed for clamping test probes to the test pads of a flexible printed circuit of a head gimbal assembly. A two-step contact method is used to prevent electro-static damage. The clamp is made of a dissipative material, as is the test probe housing. A spring-loaded slider block in the test probe housing allows the clamp to make contact with the test pads before the test pads are brought into contact with the test probes. The dissipative material of the clamp and the housing allows the electrical potential of the test pads and the electrical potential of the test probes to be equalized before the two are brought into contact with each other.

Abstract: A method and system for testing the read/write head's dynamic electrical performance on an HGA level is disclosed. A head gimbal assembly (HGA) testing system has a spin stand holding a hard disk and a tester to send test signals through an HGA. The tester sends its signals through a pre-amplifier board. The pre-amplifier board is connected to the HGA using a probe card. A set of one or more pogo pins electrically connects the pre-amplifier board to the probe card. The probes of the probe card may be at a pre-determined pitch from the pogo pins.

Abstract: A system and method are disclosed for clamping test probes to the test pads of a flexible printed circuit of a head gimbal assembly. A two-step contact method is used to prevent electro-static damage. The clamp is made of a dissipative material, as is the test probe housing. A spring-loaded slider block in the test probe housing allows the clamp to make contact with the test pads before the test pads are brought into contact with the test probes. The dissipative material of the clamp and the housing allows the electrical potential of the test pads and the electrical potential of the test probes to be equalized before the two are brought into contact with each other.