Abstract: A tester information tester information processing system provides test equipment for generating test data. A markup language encoder connected to the test equipment encodes the test data for storage in an object-oriented database management system connected to the markup language encoder, and a user interface is operatively connected to the object-oriented database management system for retrieval of the test data.

Abstract: A method and system for fault isolation in semiconductor with devices thereon includes determining test data from a plurality of semiconductor devices and creating a failure bitmap of locations of the plurality of semiconductor devices and test data in a vector graphic CAD format. The vector graphic CAD format allows storage of test data on multiple layers.

Abstract: A system and method for wafer level global bitmap characterization include determining chip level defect data bitmaps from a semiconductor wafer, and consolidating the chip level defect data bitmaps into a global wafer level bitmap that characterizes substantially the entire wafer failure configuration. The global wafer level bitmap is then analyzed and compared with other global wafer level bitmaps to develop correlations thereamong and develop global wafer level bitmap definitions for conducting at least one of wafer-to-wafer, boat-to-boat, and lot-to-lot process analysis based upon the global wafer level bitmap definitions.

Abstract: Methods are described for characterizing floating body delay effects in SOI wafers comprising providing a pulse edge to a floating body and a tied body chain in the wafer, storing tied body chain data according to one or more of the floating body devices, and characterizing the floating body delay effects according to the stored tied body chain data. Test apparatus are also described comprising a floating body chain including a plurality of series connected floating body inverters or NAND gates fabricated in the wafer and a tied body chain comprising a plurality of series connected tied body devices to in the wafer. Storage devices are coupled with the tied body devices and with one or more of the floating body devices and operate to store tied body chain data from the tied body devices according to one or more signals from floating body chain.

Abstract: Electrical parameter testing and performance testing are performed on a plurality of microelectronic devices to obtain parametric values and performance values respectively. The parametric values are applied as inputs to a computer program such as a back propagation neural network engine which generates a performance prediction model by self-learning that implements a function relating the performance values to the parametric values. The model is used to predict the performance of devices being fabricated by performing electrical parameter testing on these devices and applying the resulting parametric values to the model as inputs to produce predicted performance values as outputs. The model can be configured to produce predicted performance values as percentages of devices having speed or other parameters in predetermined respective ranges. The model can be further configured to produce predicted performance values as percentages of devices having different types of defects.

Abstract: An automated system and procedure processes wafer test bin data of semiconductor wafers to formulate a fault pattern at statistically significant levels. A processor such as a neural engine or neural network collects wafer test bin results to generate a N/N wafer map to be correlated with wafer maps produced from a wafer electrical test, a wafer level reliability test, and an in-line defect analysis. A N/N wafer map generated by the processor is cross-checked with a wafer map generated from another semiconductor tester to formulate possible overlap fault patterns. The confirmed fault patterns are further analyzed by performing failure analysis to find the root cause of fault patterns. A report containing fault patterns and the root cause for fault patterns is sent back to a fab for making adjustment to the fabrication process to increase the overall yield of the future batch of semiconductor wafers.

Abstract: A real-time in-line defect disposition and yield forecasting system for a semiconductor wafer having layer containing devices includes an in-line fabrication inspection tool, a design review station, and a yield management station. The in-line fabrication inspection tool inspects at least two layers of the semiconductor wafer and produces first information including particle size, particle location and number of particles introduced therein for each of these layers. The design review station inspects the layers of the semiconductor wafer and produces second information including layouts of each of the layers. The yield management station is operatively connected to the in-line fabrication inspection tool and to the design review station. The yield management station retrieves the first information and the second information from the in-line fabrication inspection tool and from the design review station.