Patents by Inventor Siu Ping Yip

Siu Ping Yip has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Control and monitoring system for thin die detachment and pick-up
    Patent number: 8092645
    Abstract: During detachment of a die from an adhesive tape, the inner and outer portions of a first side of the die which is in contact with the adhesive tape is supported with a support surface. A collet contacts the inner and outer portions of a second side of the die opposite to the first side. Support is withdrawn from the outer portion of the die such that the outer portion of the second side of the die bends away from the collet while the support surface only supports the inner portion of the die. Vacuum suction from the collet is applied to attract the outer portion of the die towards the collet and the vacuum suction pressure is monitored until a threshold pressure is reached indicating that the outer portion of the die is contacting the collet. Thereafter, the collet is lifted while holding the die with vacuum suction to completely separate the die from the adhesive tape.
    Type: Grant
    Filed: February 5, 2010
    Date of Patent: January 10, 2012
    Assignee: ASM Assembly Automation Ltd
    Inventors: Siu Ping Yip, Chi Ming Chong, Man Wai Chan, Kwok Wai Wong
  • CONTROL AND MONITORING SYSTEM FOR THIN DIE DETACHMENT AND PICK-UP
    Publication number: 20110192547
    Abstract: During detachment of a die from an adhesive tape, the inner and outer portions of a first side of the die which is in contact with the adhesive tape is supported with a support surface. A collet contacts the inner and outer portions of a second side of the die opposite to the first side. Support is withdrawn from the outer portion of the die such that the outer portion of the second side of the die bends away from the collet while the support surface only supports the inner portion of the die. Vacuum suction from the collet is applied to attract the outer portion of the die towards the collet and the vacuum suction pressure is monitored until a threshold pressure is reached indicating that the outer portion of the die is contacting the collet. Thereafter, the collet is lifted while holding the die with vacuum suction to completely separate the die from the adhesive tape.
    Type: Application
    Filed: February 5, 2010
    Publication date: August 11, 2011
    Inventors: Siu Ping YIP, Chi Ming CHONG, Man Wai CHAN, Kwok Wai WONG