Abstract: A method and apparatus for soldering wires of components on PC boards to a lead frame. Wires from the electronic components on a PC board supported by a fixture are led through respective pathways and particularly plated grooves on each side of the PC board. The wires within the pathways are held there by being adhered to a temporary fixture beneath the board until the wires are later affixed in their grooves by dipping the sides of the PC board in a solder pool. The excess wire tails are cut away. The PC board is then mounted on a lead frame, and the leads of the lead frame are aligned with respective pathways of the PC board. The PC board and lead frame are then dipped in solder which electrically connects the wires in their respective pathways to the leads of the lead frame.