Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for verification and re-use of process fluids. The apparatus generally includes a tool for performing lithography, and a recirculation path coupled to the tool. The recirculation path generally includes a collection unit coupled at first end to a first end of the tool, and a probe coupled at a first end to a second end of the collection unit, the probe for determining one or more characteristics of a fluid flowing from the tool. The recirculation path of the apparatus further generally includes a purification unit coupled at a first end to a third end of the collection unit, the purification unit further coupled at a second end to a second end of the probe, the purification unit for changing a characteristic of the fluid.

Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for verification and re-use of process fluids. The apparatus generally includes a tool for performing lithography, and a recirculation path coupled to the tool. The recirculation path generally includes a collection unit coupled at first end to a first end of the tool, and a probe coupled at a first end to a second end of the collection unit, the probe for determining one or more characteristics of a fluid flowing from the tool. The recirculation path of the apparatus further generally includes a purification unit coupled at a first end to a third end of the collection unit, the purification unit further coupled at a second end to a second end of the probe, the purification unit for changing a characteristic of the fluid.

Abstract: Embodiments of the disclosure relate to lithography simulation and optical proximity correction. Field-guided post exposure bake processes have enabled improved lithography performance and various parameters of such processes are included in the optical proximity correction models generated in accordance with the embodiments described herein. An optical proximity correction model includes one or more parameters of anisotropic acid etching characteristics, ion generation and/or movement, electron movement, hole movement, and chemical reaction characteristics.

Abstract: Methods and apparatuses for minimizing line edge/width roughness in lines formed by photolithography are provided. A method of processing a substrate is provided. The method includes applying a photoresist layer that includes a photoacid generator to a multi-layer disposed on the substrate. The multi-layer includes an underlayer. Further, the method includes exposing a first portion of the photoresist layer unprotected by a photomask to a radiation light in a lithographic exposure process. A thermal energy is provided to the photoresist layer and the multi-layer in a post-exposure baking process. The multi-layer is disposed beneath the photoresist layer. An electric field or a magnetic field is applied to photoresist layer and the multi-layer while performing the post-exposure baking process. An additive within the underlayer is driven in a vertical direction into the photoresist layer. The additive assist in distribution of a photoacid throughout the photoresist layer during the post-exposure baking process.

Abstract: A die bonding apparatus comprising a first inert gas container having a first inert gas concentration, and a second inert gas container having a second inert gas concentration enclosed within the first inert gas container. The second inert gas concentration is higher than the first inert gas concentration. The die bonding apparatus further comprises a bond head located in the second inert gas container for receiving a die for bonding, and a third inert gas container having an inert gas environment that is separate from the first and second inert gas containers and where a substrate is locatable for die bonding. The bond head is operative to move the die between a first position within the second inert container and a second position within the third inert gas container to bond the die onto the substrate located in the third inert gas container.

Abstract: A die bonding apparatus comprising a first inert gas container having a first inert gas concentration, and a second inert gas container having a second inert gas concentration enclosed within the first inert gas container. The second inert gas concentration is higher than the first inert gas concentration. The die bonding apparatus further comprises a bond head located in the second inert gas container for receiving a die for bonding, and a third inert gas container having an inert gas environment that is separate from the first and second inert gas containers and where a substrate is locatable for die bonding. The bond head is operative to move the die between a first position within the second inert container and a second position within the third inert gas container to bond the die onto the substrate located in the third inert gas container.

Abstract: A system for bonding electrical devices using an electrically conductive adhesive to adhere the electrical devices together, the system including: an ultrasonic transducer to generate an ultrasonic vibration; and an ultrasonic to thermal energy apparatus operatively attached to and covering an operational end of the ultrasonic transducer, the ultrasonic to thermal energy apparatus damping the ultrasonic vibration to minimize ultrasonic vibration transmitted to a first electrical device and causing the conversion of the ultrasonic vibration to a heating pulse which is conducted through the first electrical device to the adhesive. Whereby the adhesive is softened by the heating pulse to bond the electrical devices together.

Abstract: A method of aligning a die when the die is held with a circuit pattern on a first side of the die facing away from an infrared light source, wherein infrared light from the infrared light source is projected onto a second side of the die opposite to the first side such that the infrared light passes through a body of the die. From the second side of the die, an image of the infrared light reflected from the circuit pattern is detected and captured. Thereafter, an alignment of the die from the captured image of the die is determined.

Abstract: A system and a method for self-aligned dual patterning are described. The system includes a platform for supporting a plurality of process chambers. An etch process chamber coupled to the platform. An ultra-violet radiation photo-resist curing process chamber is also coupled to the platform.

Abstract: Methods to pattern features in a substrate layer by exposing a photoresist layer more than once. In one embodiment, a single reticle may be exposed more than once with an overlay offset implemented between successive exposures to reduce the half pitch of the reticle. In particular embodiments, these methods may be employed to reduce the half pitch of the features printed with 65 nm generation lithography equipment to achieve 45 nm lithography generation CD and pitch performance.

Abstract: An apparatus for detecting the presence of a microorganism in a sample includes a housing that includes a base fixed with a first DNA primer having a nucleotide sequence that is complementary to a DNA sequence of the microorganism of interest, a fibrinogen-splitting agent that is bound with a second DNA primer having a nucleotide sequence that is also complementary to a DNA sequence of the microorganism of interest, a rinsing unit configured to rinse the housing; and a fibrinogen adding unit configured to add fibrinogen to the housing so that the fibrinogen chemically reacts with the fibrinogen-splitting agent to produce a viscous substance, an ultrasonic emitter configured to emit ultrasonic signal to the housing, and an ultrasonic receiver configured to receive ultrasonic signal from the housing and transmit the received ultrasonic signal to an ultrasonic analyzer, wherein the ultrasonic analyzer determines whether the microorganism of interest exists.

Abstract: A system for bonding electrical devices using an electrically conductive adhesive to adhere the electrical devices together, the system including: an ultrasonic transducer to generate an ultrasonic vibration; and an ultrasonic to thermal energy apparatus operatively attached to and covering an operational end of the ultrasonic transducer, the ultrasonic to thermal energy apparatus damping the ultrasonic vibration to minimise ultrasonic vibration transmitted to a first electrical device and causing the conversion of the ultrasonic vibration to a heating pulse which is conducted through the first electrical device to the adhesive. Whereby the adhesive is softened by the heating pulse to bond the electrical devices together.

Abstract: A system for bonding electrical devices using an electrically conductive adhesive to adhere the electrical devices together, the system comprising: an ultrasonic transducer to generate an ultrasonic vibration; and an ultrasonic to thermal energy apparatus operatively attached to and covering an operational end of the ultrasonic transducer, the ultrasonic to thermal energy apparatus damping the ultrasonic vibration to minimize ultrasonic vibration transmitted to a first electrical device and causing the conversion of the ultrasonic vibration to a heating pulse which is conducted through the first electrical device to the adhesive; wherein the adhesive is softened by the heating pulse to bond the electrical devices together.

Abstract: An apparatus for detecting the presence of a microorganism in a sample includes a housing that includes a base fixed with a first DNA primer having a nucleotide sequence that is complementary to a DNA sequence of the microorganism of interest, a fibrinogen-splitting agent that is bound with a second DNA primer having a nucleotide sequence that is also complementary to a DNA sequence of the microorganism of interest, a rinsing unit configured to rinse the housing; and a fibrinogen adding unit configured to add fibrinogen to the housing so that the fibrinogen chemically reacts with the fibrinogen-splitting agent to produce a viscous substance, an ultrasonic emitter configured to emit ultrasonic signal to the housing, and an ultrasonic receiver configured to receive ultrasonic signal from the housing and transmit the received ultrasonic signal to an ultrasonic analyzer, wherein the ultrasonic analyzer determines whether the microorganism of interest exists.

Abstract: A system and a method for self-aligned dual patterning are described. The system includes a platform for supporting a plurality of process chambers. An etch process chamber coupled to the platform. An ultra-violet radiation photo-resist curing process chamber is also coupled to the platform.

Abstract: A system and a method for self-aligned dual patterning are described. The system includes a platform for supporting a plurality of process chambers. An etch process chamber coupled to the platform. An ultra-violet radiation photo-resist curing process chamber is also coupled to the platform.

Abstract: A method of aligning a die when the die is held with a circuit pattern on a first side of the die facing away from an infrared light source, wherein infrared light from the infrared light source is projected onto a second side of the die opposite to the first side such that the infrared light passes through a body of the die. From the second side of the die, an image of the infrared light reflected from the circuit pattern is detected and captured. Thereafter, an alignment of the die from the captured image of the die is determined.

Abstract: A system for bonding electrical devices using an electrically conductive adhesive to adhere the electrical devices together, the system comprising: an ultrasonic transducer to generate an ultrasonic vibration; and an ultrasonic to thermal energy apparatus operatively attached to and covering an operational end of the ultrasonic transducer, the ultrasonic to thermal energy apparatus damping the ultrasonic vibration to minimize ultrasonic vibration transmitted to a first electrical device and causing the conversion of the ultrasonic vibration to a heating pulse which is conducted through the first electrical device to the adhesive; wherein the adhesive is softened by the heating pulse to bond the electrical devices together.

Abstract: An optical system for viewing an object has a plurality of lenses and a main optical axis coincident with the centers of the lenses. The optical system further comprises a low magnification optical subsystem that is operative to view the object at a first magnification and a high magnification optical subsystem that is operative to view the object at a second magnification that is higher than the first magnification. The high magnification optical subsystem has a high magnification optical axis along which light rays that are received from the main optical axis are transmitted. A movable element is locatable on the high magnification optical axis and is movable in directions transverse to the axis for receiving and transmitting light rays.

Abstract: An magnetorheological damper useful in structural vibration control has a damper body and a moveable portion relative to the damper body. The damper includes an magnetorheological material contained within the damper body for resisting movement of the moveable portion. Rheology changes can be generated in the magnetorheological material owing to changes in a magnetic field, to which the magnetorheological material is exposed. The damper further includes at least a sensor embedded in the damper for monitoring an external force exerted on the damper, and for generating a signal to control the magnetic field and hence the resulting yield force and rheological damping of the damper in response to a variance in the external force.