Patents by Inventor Siva Chennupati

Siva Chennupati has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for shielding of electromagnetic interference of a memory module
    Publication number: 20070274059
    Abstract: An apparatus for shielding of electromagnetic interference of a memory module comprises a heat spreader covering at least partially said memory module, wherein said heat spreader is connected to at least one floating gate which is provided between first plates of matched integrated capacitors, wherein second plates of said matched integrated capacitors each comprise a constant potential.
    Type: Application
    Filed: May 25, 2006
    Publication date: November 29, 2007
    Inventor: Siva (Chennupati)Raghuram
  • Circuit module having interleaved groups of circuit chips
    Patent number: 6917100
    Abstract: A circuit module has a carrier (10) and multiple stacks of circuit chips arranged on a surface of the carrier. Each stack has multiple circuit chips arranged in different layers. The circuit chips are grouped in different groups, wherein the groups are not active at the same time. The circuit chips are arranged such that circuit chips belonging to the same group are arranged in different layers in adjacent stacks.
    Type: Grant
    Filed: February 24, 2004
    Date of Patent: July 12, 2005
    Assignee: Infineon Technologies AG
    Inventor: Siva Chennupati
  • Circuit module having interleaved groups of circuit chips
    Publication number: 20040222507
    Abstract: A circuit module has a carrier (10) and multiple stacks of circuit chips arranged on a surface of the carrier. Each stack has multiple circuit chips arranged in different layers. The circuit chips are grouped in different groups, wherein the groups are not active at the same time. The circuit chips are arranged such that circuit chips belonging to the same group are arranged in different layers in adjacent stacks.
    Type: Application
    Filed: February 24, 2004
    Publication date: November 11, 2004
    Inventor: Siva Chennupati