Patents by Inventor Sivadasan K. Kulangara

Sivadasan K. Kulangara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7751153
    Abstract: A head suspension assembly couples a baseplate to a rotatable load through a planar triangular piezo microactuator for effecting hingeless rotation of the load. The microactuator expands, responsive to an excitation voltage, with greater magnitude in one direction than in another direction normal to the first direction, resulting in an angular movement of the hypotenuse thereby rotating the load. The upper surface of the microactuator is grounded to a bottom surface of the baseplate or load beam to position the microactuator lead connection surface closest to the load to facilitate trace routing. A load beam grounding surface may be raised to accommodate the microactuator and fix the lead connection surface on a common plane with the unraised surface to further minimize trace routing and provide access for bonding the trace to the load beam.
    Type: Grant
    Filed: July 31, 2009
    Date of Patent: July 6, 2010
    Assignee: Magnecomp Corporation
    Inventors: Sivadasan K. Kulangara, Shijin Mei, Steve Misuta, Christopher Schreiber
  • Patent number: 7595965
    Abstract: A head suspension assembly couples a baseplate to a rotatable load through a planar triangular piezo microactuator for effecting hingeless rotation of the load. The microactuator expands, responsive to an excitation voltage, with greater magnitude in one direction than in another direction normal to the first direction, resulting in an angular movement of the hypotenuse thereby rotating the load. The upper surface of the microactuator is grounded to a bottom surface of the baseplate or load beam to position the microactuator lead connection surface closest to the load to facilitate trace routing. A load beam grounding surface may be raised to accommodate the microactuator and fix the lead connection surface on a common plane with the unraised surface to further minimize trace routing and provide access for bonding the trace to the load beam.
    Type: Grant
    Filed: November 18, 2005
    Date of Patent: September 29, 2009
    Assignee: Magnecomp Corporation
    Inventors: Sivadasan K. Kulangara, Shijin Mei, Steve Misuta, Chris Schreiber