Abstract: Apparatuses and methods for regulating a system rail voltage of a battery charger is described. An integrated circuit can be configured to detect a condition that requires an activation of a trickle charge mode of a battery charger. The integrated circuit can, in response to the detection, set a reference voltage to an intermediate voltage level. The reference voltage can control a system rail voltage of the battery charger, and the intermediate voltage level can be greater than a minimum of the system rail voltage. The integrated circuit can reduce the reference voltage from the intermediate voltage level to the minimum system rail voltage to regulate the system rail voltage at a predefined rate.

Abstract: The innovation relates to systems and/or methodologies for error detection during sub-assembly in high voltage analog circuits. A signal driver communicates test signals to one or more high voltage analog circuits, and a state machine compares the electrical and/or thermal responses of the high voltage analog circuits to a set of predetermined expected results (e.g., signatures). The signal driver and state machine can be incorporated into the high voltage analog circuits. The expected results can be stored in the target circuits in the form of look-up tables, matrices, and so forth. Errors, such as, dry solders and bridge solders can be determined based on the comparison of the obtained responses to the expected signatures.

Abstract: The innovation relates to systems and/or methodologies for error detection during sub-assembly in high voltage analog circuits. A signal driver communicates test signals to one or more high voltage analog circuits, and a state machine compares the electrical and/or thermal responses of the high voltage analog circuits to a set of predetermined expected results (e.g., signatures). The signal driver and state machine can be incorporated into the high voltage analog circuits. The expected results can be stored in the target circuits in the form of look-up tables, matrices, and so forth. Errors, such as, dry solders and bridge solders can be determined based on the comparison of the obtained responses to the expected signatures.