Abstract: A system includes a heat sink module and a driving circuit module. The heat sink module includes stepped through-holes that each includes a cylindrical upper and lower portions connected by a ring-shaped surface. The bottom surface of the heat sink module includes grooves that respectively pass through the lower portions of respective sequences of the stepped through-holes. The driving circuit module includes conductive connectors and electrical driving surfaces that are disposed external to the heat sink module. Each conductive connector lies within a respective groove in the bottom surface of the heat sink module. The conductive connectors include internal connectors that each link at least two stepped through-holes in a respective sequence of stepped through-holes passed by a respective groove, and include external connectors that each link at least one stepped through-hole in the respective sequence of stepped through-holes to the electrical driving surfaces.

Abstract: The present disclosure describes a diode laser array module that includes a plurality of diode lasers, a cooling module, and a pin connector module. The cooling module includes a heat sink that has structural features configured to allow pins of the diode lasers to be connected to a first conductive portion of the pin connector module within a recessed area in the bottom surface of the cooling module, where a second conductive portion of the pin connector module moves beyond the recessed area and is configured to be connected to a driving circuit module at a location outside of the recessed area in the bottom surface of the cooling module. Similarly principles are u to construct a diode laser array module comprising bank packaged diode laser modules, pin connector modules for the bank packaged diode laser modules, and a cooling module.

Abstract: A system includes a heat sink module and a driving circuit module. The heat sink module includes stepped through-holes that each includes a cylindrical upper and lower portions connected by a ring-shaped surface. The bottom surface of the heat sink module includes grooves that respectively pass through the lower portions of respective sequences of the stepped through-holes. The driving circuit module includes conductive connectors and electrical driving surfaces that are disposed external to the heat sink module. Each conductive connector lies within a respective groove in the bottom surface of the heat sink module. The conductive connectors include internal connectors that each link at least two stepped through-holes in a respective sequence of stepped through-holes passed by a respective groove, and include external connectors that each link at least one stepped through-hole in the respective sequence of stepped through-holes to the electrical driving surfaces.

Abstract: A system includes: a heat sink module with a plurality of first through-holes linking its top and bottom surfaces and a plurality of grooves on the bottom surface, wherein each groove passes through a respective sequence of the first through-holes; and a driving circuit module with a plurality of conductive connectors and electrical driving surfaces that are disposed substantially perpendicular to the top and bottom surfaces of the heat sink module, wherein each conductive connector lies partially within a respective groove in the bottom surface of the heat sink module, the conductive connectors include internal connectors that each links at least two of the first through-holes in a respective sequence of first through-holes, and external connectors that each links at least one of the first through-holes in a respective sequence of first through-holes to an electrical driving surfaces of the driving circuit module.

Abstract: A system includes: a heat sink module with a plurality of first through-holes linking its top and bottom surfaces and a plurality of grooves on the bottom surface, wherein each groove passes through a respective sequence of the first through-holes; and a driving circuit module with a plurality of conductive connectors and electrical driving surfaces that are disposed substantially perpendicular to the top and bottom surfaces of the heat sink module, wherein each conductive connector lies partially within a respective groove in the bottom surface of the heat sink module, the conductive connectors include internal connectors that each links at least two of the first through-holes in a respective sequence of first through-holes, and external connectors that each links at least one of the first through-holes in a respective sequence of first through-holes to an electrical driving surfaces of the driving circuit module.