Abstract: An electronic assembly comprises a flexible polymer membrane having a surface with one or more electrically conductive traces arranged on the surface, a light-emissive semiconductor die having first and second electrical contacts bonded to the one or more electrically conductive traces via a cured electrically conductive adhesive, and a flexible cover layer arranged over the surface of the polymer membrane and the semiconductor die.

Abstract: Described herein is a sensor including a sensing electrode structure and a motion-responsive structure in capacitive communication with the sensing electrode structure, the sensing electrode structure and the motion-responsive structure being separated by a first dielectric layer, the motion-responsive structure comprising a liquid metal mass within a matrix in which the liquid metal mass is movable based upon movement of the sensor, and the sensing electrode structure comprising a first electrode, and a second electrode spaced from the first electrode to form a capacitor.

Abstract: Aqueous dispersions of artificially synthesized, mussel-inspired polyopamine nanoparticles were inkjet printed on flexible polyethylene terephthalate (PET) substrates. Narrow line patterns (4 ?m in width) of polydopamine resulted due to evaporatively driven transport (coffee ring effect). The printed patterns were metallized via a site-selective Cu electroless plating process at a controlled temperature (30° C.) for varied bath times. The lowest electrical resistivity value of the plated Cu lines was about 6 times greater than the bulk resistivity of Cu. This process presents an industrially viable way to fabricate Cu conductive fine patterns for flexible electronics at low temperature, and low cost.

Abstract: A yarn adaptable to incorporation into a textile comprises a core including one or more electrically conductive traces arranged on the core and distributed over at least a portion of the length of the yarn. The yarn also comprises an electrically contactable terminal arranged at a terminus of the one or more conductive traces and a winding wrapped around the core.

Abstract: Examples are disclosed that relate to touch sensors formed on fabrics. One example provides a touch sensor including a fabric layer, a first electrode having a conductive ink disposed on the fabric layer, a dielectric structure disposed over the first electrode, the dielectric structure including an electrode support layer and an adhesive layer bonding the electrode support layer to the fabric layer and the first electrode, and the touch sensor also including a second electrode disposed on the electrode support layer.

Abstract: Examples are disclosed that relate to mapping a plurality of temperatures across an area. One example provides a temperature sensing device including a flexible support and a temperature sensing structure having a plurality of individually readable temperature sensing junctions. The temperature sensing structure includes a line of a first conductive material extending across an area of the support, and a plurality of lines of a second conductive material each intersecting the line of the first junction material at a corresponding sensing junction.

Abstract: Touchscreen computing devices are often assembled by applying an adhesive to an interface perimeter between a cover glass and a chassis. Occasionally, a device is de-bonded to troubleshoot errors in the functionality of the device. The adhesive often is resistant to releasing the bond between the cover glass and a chassis by mechanical force and the cover glass may be damaged during disassembly. Passive and/or active de-bonding aids facilitate transfer of thermal energy to the adhesive in a manner that avoids or minimizes the transfer of thermal energy to heat-sensitive components of the device.

Abstract: An electronic assembly comprises a flexible polymer membrane having a surface with one or more electrically conductive traces arranged on the surface, a light-emissive semiconductor die having first and second electrical contacts bonded to the one or more electrically conductive traces via a cured electrically conductive adhesive, and a flexible cover layer arranged over the surface of the polymer membrane and the semiconductor die.

Abstract: Examples disclosed herein relate to using optical fibers in a textile to channel light from a light source to various exit locations within the textile. One example provides an optical device, comprising a light source, an optical fiber extending from the light source, the optical fiber configured to conduct light received from the light source via internal reflection, and a plurality of individually controllable light-emitting locations disposed along the optical fiber.

Abstract: Examples are disclosed that relate to flexible electrical interconnects in electronic devices. One example provides a device including a flexible substrate, a conductive trace disposed on the flexible substrate, an electronic component mounted to the flexible substrate, a liquid metal interconnect bridging between a pad on the component and the trace on the flexible substrate, and an encapsulant covering the interconnect.

Abstract: One disclosed example comprises an ink formulated for printing an electrically conductive trace on a flexible fabric substrate. The ink includes an elastomer and a liquid vehicle capable of swelling the elastomer, the liquid vehicle having a boiling point of 150° C. or greater at one atmosphere. A plurality of non-spherical, electrically conductive particles are suspended in the liquid vehicle to impart electrical conductivity to the ink.

Abstract: Examples of force sensors that may be incorporated into a number of devices or other objects are disclosed. In one example, a sensor includes a substrate including a first electrode and a second electrode, the first electrode and the second electrode being spaced by an insulating gap, and a compliant material with plural conductive pathways disposed over the gap and contacting the first electrode and the second electrode such that a resistance of an electrical path passing through the compliant material between the first electrode and the second electrode changes in response to force of the compliant material against one or more of the first electrode and the second electrode.

Abstract: Examples are disclosed that relate to screen printing liquid metal materials. One example provides a method to deposit a metal pattern onto a substrate. The method includes placing a textile over the substrate, the textile having a plurality of pores wettable by a liquid metal. The method further includes forcing the liquid metal through the pores of the textile and onto the substrate, and separating the substrate and textile.

Abstract: Described herein is an electrostatic slide clutch comprising a first electrode, a second electrode oriented parallel to first electrode, an electrically insulating structure disposed on the first electrode on a face of the first electrode opposing the second electrode, and a controller electrically coupled to the first electrode and to the second electrode and configured to apply a variable voltage between the first and second electrodes, to influence a normal force between the first and second electrodes.

Abstract: Described herein is a sensor including a sensing electrode structure and a motion-responsive structure in capacitive communication with the sensing electrode structure, the sensing electrode structure and the motion-responsive structure being separated by a first dielectric layer, the motion-responsive structure comprising a liquid metal mass within a matrix in which the liquid metal mass is movable based upon movement of the sensor, and the sensing electrode structure comprising a first electrode, and a second electrode spaced from the first electrode to form a capacitor.

Abstract: One example provides a circuit structure comprising a liquid metal conductive path enclosed in an encapsulant, a polymer circuit support comprising a polymer having a functional species available for a condensation reaction, and a cross-linking agent covalently bonding the encapsulant to the polymer circuit support via the functional species.

Abstract: Examples are provided for a flexible circuit element including a flexible insulating support structure, a solid metal trace extending at least partially between a first connector and a second connector on the flexible insulating support structure, and a liquid metal conductor disposed in contact with the solid metal trace in a region of the trace configured to repeatedly flex when installed in a device.

Abstract: One example provides a flexible electrical interconnect comprising a substrate, a liquid conductive pathway supported by the substrate, and a conductively anisotropic, magnetic particle-embedded encapsulant that interfaces with the liquid conductive pathway for connecting to another circuit element.

Abstract: Examples for force-sensing elements are disclosed. An example method for forming a force sensor includes printing a suspension of a hollow-sphere conductive polymer in a liquid carrier over an electrode pair on a substrate, evaporating the liquid carrier, and encapsulating the electrode pair and hollow-sphere conductive polymer to form a force sensor.

Abstract: Examples are provided for a flexible circuit element including a flexible insulating support structure, a solid metal trace extending at least partially between a first connector and a second connector on the flexible insulating support structure, and a liquid metal conductor disposed in contact with the solid metal trace in a region of the trace configured to repeatedly flex when installed in a device.