Abstract: A substrate support for a plasma chamber includes a base plate arranged along a plane, a first layer of an electrically insulating material arranged on the base plate along the plane, a plurality of heating elements arranged in the first layer along the plane, and a plurality of diodes arranged in respective cavities in the first layer. The plurality of diodes are connected in series to the plurality of heating elements, respectively. Each of the plurality of diodes includes a die of a semiconductor material arranged in a respective one of the cavities. The semiconductor material has a first coefficient of thermal expansion. A first side of the die is arranged on the first layer along the plane. A first terminal of the die is connected to a first electrical contact on the first layer.

Abstract: A substrate support for a plasma chamber includes a base plate arranged along a plane, a first layer of an electrically insulating material arranged on the base plate along the plane, a plurality of heating elements arranged in the first layer along the plane, and a plurality of diodes arranged in respective cavities in the first layer. The plurality of diodes are connected in series to the plurality of heating elements, respectively. Each of the plurality of diodes includes a die of a semiconductor material arranged in a respective one of the cavities. The semiconductor material has a first coefficient of thermal expansion. A first side of the die is arranged on the first layer along the plane. A first terminal of the die is connected to a first electrical contact on the first layer.

Abstract: Various embodiments include a reflectometer and a reflectometry system for monitoring movements of a substrate, such as a silicon wafer. In one embodiment, a reflectometry system monitors and controls conditions associated with a substrate disposed within a process chamber. The process chamber includes a substrate-holding device having an actuator mechanism to control movement of the substrate with respect to the substrate-holding device. The reflectometry system includes a light source configured to emit a beam of light directed at the substrate, collection optics configured to receive light reflected from the substrate by the beam of light directed at the substrate and output a signal related to one or more conditions associated with the substrate, and a processor configured to process the signal and direct the actuator mechanism to control the movement of the substrate with respect to the substrate-holding device based on the signal. Other devices and methods are disclosed.

Abstract: Various embodiments include a reflectometer and a reflectometry system for monitoring movements of a substrate, such as a silicon wafer. In one embodiment, a reflectometry system monitors and controls conditions associated with a substrate disposed within a process chamber. The process chamber includes a substrate-holding device having an actuator mechanism to control movement of the substrate with respect to the substrate-holding device. The reflectometry system includes a light source configured to emit a beam of light directed at the substrate, collection optics configured to receive light reflected from the substrate by the beam of light directed at the substrate and output a signal related to one or more conditions associated with the substrate, and a processor configured to process the signal and direct the actuator mechanism to control the movement of the substrate with respect to the substrate-holding device based on the signal. Other devices and methods are disclosed.

Abstract: A substrate support assembly includes a baseplate to support at least one layer to be disposed thereon and a first printed circuit board coupled to the baseplate by a plurality of mounting assemblies that allow the baseplate to move relative to the first printed circuit board.

Abstract: A substrate support includes: a baseplate; a top plate disposed above the baseplate and configured to support a substrate during processing of the substrate; and a bonding layer bonding the top plate to the baseplate. The bonding layer includes: multiple studs separating the top plate from the baseplate; and a bonding material disposed in areas laterally surrounding the studs and located between the top plate and the baseplate.

Abstract: Wafer chucks or baseplates therefor are disclosed that feature thermal tuning cavity features that are positioned and sized so as to provide a more uniform temperature distribution across a wafer support surface of such a wafer chuck. Each thermal tuning cavity feature may be positioned adjacent to a portion or portions of a heat exchange passage or passages within a baseplate of the wafer chuck. By locating thermal tuning cavity features in locations underneath where the wafer support surface of the wafer chuck would otherwise demonstrate localized regions of lower temperature (as compared with adjacent regions of the wafer chuck support surface), the lower-temperature regions may be caused to have elevated temperatures that more closely match the surrounding temperatures, thereby increasing temperature uniformity.

Abstract: Various embodiments include apparatuses to raise and lower substrates, as used in the semiconductor and allied industries, toward or away from a substrate-holding mechanism (e.g., such as an electrostatic chuck (ESC). In a specific embodiment, a substrate lift-mechanism includes a number of pins to position the substrate above a substrate-holding device. Mid-position sensors are respectively coupled to a corresponding pin. The mid-position sensors monitor an intermediate position of the corresponding pin between a maximum position and a minimum position. Other apparatuses and systems are disclosed.

Abstract: A sensor probe includes an elongated body defining an inner cavity having an inner diameter. A printed circuit board is configured to be fitted within the inner cavity. A first temperature-sensing integrated circuit mounted at a first end of the printed circuit board. A cap is mounted to a first end of the elongated body adjacent to the first temperature-sensing integrated circuit. A housing is configured to receive a second end of the elongated body, wherein the housing is configured to be mounted to a baseplate of a substrate support.

Abstract: A magnetic levitation bearing, a magnetic levitation rotor support assembly, and a compressor. The magnetic levitation bearing is used for supporting a rotor by interacting with a thrust disc on the rotor, and comprises: a radial stator core having an annular structure, which is disposed on a radial outer side of the thrust disc and corresponds to the thrust disc in an axial direction of the rotor, the radial stator core and the thrust disc being separated by a first radial gap X1; and a radial control coil, which is disposed on the radial stator core and can generate a radial electromagnetic force to the thrust disc in a radial direction of the rotor.

Abstract: A substrate support for a plasma chamber includes a base plate arranged along a plane, a first layer of an electrically insulating material arranged on the base plate along the plane, a plurality of heating elements arranged in the first layer along the plane, and a plurality of diodes arranged in respective cavities in the first layer. The plurality of diodes are connected in series to the plurality of heating elements, respectively. Each of the plurality of diodes includes a die of a semiconductor material arranged in a respective one of the cavities. The semiconductor material has a first coefficient of thermal expansion. A first side of the die is arranged on the first layer along the plane. A first terminal of the die is connected to a first electrical contact on the first layer.

Abstract: The present disclosure provides a wiring structure of a magnetic suspension bearing, a compressor and an air conditioner. The wiring structure of a magnetic suspension bearing, for electrically connect a control coil of the magnetic suspension bearing with an external power source, includes a circuit board; wherein the number of the magnetic suspension bearing is two or more, and the control coils of the two or more magnetic suspension bearings are all configured to electrically connect to the circuit board, and the circuit board is configured to connect to the external power source. The present disclosure has the advantages of reasonable design, simple structure, implementation of integrating wiring of multiple magnetic suspension bearings, simplification of wiring work, improvement of production efficiency, and improvement of wiring reliability.

Abstract: The present disclosure provides a wiring structure of a magnetic suspension bearing, a compressor and an air conditioner. The wiring structure of a magnetic suspension bearing, for electrically connect a control coil of the magnetic suspension bearing with an external power source, includes a circuit board; wherein the number of the magnetic suspension bearing is two or more, and the control coils of the two or more magnetic suspension bearings are all configured to electrically connect to the circuit board, and the circuit board is configured to connect to the external power source. The present disclosure has the advantages of reasonable design, simple structure, implementation of integrating wiring of multiple magnetic suspension bearings, simplification of wiring work, improvement of production efficiency, and improvement of wiring reliability.

Abstract: A connection terminal for a heating element of a substrate support in a substrate processing system include a contact plate configured to be electrically connected to a contact pad of the heating element within a ceramic layer of the substrate support. A wire connection portion extends from the contact plate and is configured to receive and retain a wire arranged to provide electrical power to the heating element. At least one of the contact plate and the wire connection portion comprises a first material having a first coefficient of thermal expansion (CTE) that is within 20% of a second CTE of the ceramic layer.

Abstract: An electrical connector includes first, second, third, and fourth electrical conductors. The first, second, third, and fourth electrical conductors each include a first end to be electrically connected to a respective electrically conductive pad formed on a surface of a ceramic layer of a substrate support and a second end to be electrically connected to a respective wire within a through hole in the substrate support. The electrical connector also includes a retainer to hold the first, second, third, and fourth electrical conductors in place.

Abstract: The present disclosure relates to a stator assembly of a magnetic suspension bearing and a manufacturing method, wherein the stator assembly includes stator cores, coils and two stator core frames, two of the stator core frames being respectively engaged at both ends of the stator core along an axial direction thereof, wherein a concave portion is provided at an engaged end of one of the stator core frames, and a convex portion is provided at an engaged end of the other of the stator core frames, the concave portion and the convex portion are engaged with each other, and each of the coils is wound correspondingly to teeth of the stator cores.

Abstract: A substrate support for a plasma system includes a first layer being made of a ceramic and having a first surface and a second surface opposite the first surface. The first layer is configured to support a substrate on the first surface during processing. A thermal heating element is embedded within the ceramic. A temperature sensor that is embedded within the ceramic. Electrically conductive pads are: electrically connected to the temperature sensor via first wires embedded in the ceramic; and formed on the second surface of the first layer. A second layer includes a through hole through the second layer. A connector extends through the through hole and that includes: a retainer; and electrical conductors that are held by the retainer and that include: first ends that are electrically connected to the electrically conductive pads, respectively; and second ends that are electrically connected to a temperature controller by wire.

Abstract: A magnetic levitation bearing assembly, including: a magnetic levitation bearing, a shell, and a working clearance adjusting device; the magnetic levitation bearing includes a first iron core, a second iron core and a thrust disk; the working clearance adjusting device is arranged between a radial inner periphery of the shell and the thrust disk along the radial direction, and between the shell and the second iron core along the axial direction; an axial end of the working clearance adjusting device is abutted against the second iron core, a void gap is provided between the shell and the second iron core, an adjustment on the magnetic levitation bearing working clearance is made possible by altering the length between two axial ends of the working clearance adjusting device, such that the working clearance is consistent with a design value.

Abstract: The present invention provides a protective structure for a magnetic bearing and a magnetic bearing assembly. The protective structure for a magnetic bearing comprises: a first radial bearing protective component, sleeved on a shaft and in a position corresponding to a magnetic bearing, a first gap being radially formed between the first radial bearing protective component and the shaft; and a second radial bearing protective component, sleeved on the shaft and in a position corresponding to the magnetic bearing, a second gap being radially formed between the second radial bearing protective component and the shaft; the height of a working gap being greater than the height of the second gap, the height of the second gap being greater than the height of the first gap.

Abstract: A magnetic levitation bearing, a magnetic levitation rotor support assembly, and a compressor. The magnetic levitation bearing is used for supporting a rotor by interacting with a thrust disc on the rotor, and comprises: a radial stator core having an annular structure, which is disposed on a radial outer side of the thrust disc and corresponds to the thrust disc in an axial direction of the rotor, the radial stator core and the thrust disc being separated by a first radial gap X1; and a radial control coil, which is disposed on the radial stator core and can generate a radial electromagnetic force to the thrust disc in a radial direction of the rotor.