Abstract: An optical modulator includes an input port, a first waveguide region comprising silicon and optically coupled to the input port, and a waveguide splitter optically coupled to the first waveguide region and having a first output and a second output. The optical modulator also includes a first phase adjustment section optically coupled to the first output and comprising a first III-V diode and a second phase adjustment section optically coupled to the second output and comprising a second III-V diode. The optical modulator further includes a waveguide coupler optically coupled to the first phase adjustment section and the second phase adjustment section, a second waveguide region comprising silicon and optically coupled to the waveguide coupler, and an output port optically coupled to the second waveguide region.

Abstract: A method of fabricating a composite semiconductor structure includes providing an SOI substrate including a plurality of silicon-based devices, providing a compound semiconductor substrate including a plurality of photonic devices, and dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method also includes providing an assembly substrate having a base layer and a device layer including a plurality of CMOS devices, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, and aligning the SOI substrate and the assembly substrate. The method further includes joining the SOI substrate and the assembly substrate to form a composite substrate structure and removing at least the base layer of the assembly substrate from the composite substrate structure.

Abstract: A method of fabricating a composite semiconductor structure includes providing a first substrate comprising a first material and having a first surface and forming a plurality of pedestals extending to a predetermined height in a direction normal to the first surface. The method also includes attaching a plurality of elements comprising a second material to each of the plurality of pedestals, providing a second substrate having one or more structures disposed thereon, and aligning the first substrate and the second substrate. The method further includes joining the first substrate and the second substrate to form the composite substrate structure and removing at least a portion of the first substrate from the composite substrate structure.

Abstract: A multiple resonance interferometer structure includes an input port and a first arm coupled to the input port and including a first resonant structure.

Abstract: A transceiver includes an optical waveguide and a first filter optically coupled to the optical waveguide and operable to filter a first optical signal in a first wavelength band propagating downstream. A center wavelength of the first wavelength band is tunable. The transceiver also includes a first receiver optically coupled to the first filter and a second filter optically coupled to the optical waveguide and operable to filter a second optical signal in a second wavelength band propagating downstream. The second wavelength band is different from the first wavelength band. The transceiver further includes a second receiver optically coupled to the second filter to receive the second optical signal and a laser optically coupled to the optical waveguide and operable to output radiation in a third wavelength band propagating upstream. The third wavelength band is different from both the first wavelength band and the second wavelength band.