Patents by Inventor Sky CHEN

Sky CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260140855
    Abstract: A system may utilize a large language model (LLM). The system may train and test agents via an LLM by using the LLM to generate a set of scenarios and a set of training data and then training the agents using the training data and executing the agents accordingly. The system may also perform evaluations of data within a data table via LLMs and evaluations of prompt templates using a set of data from the data table. In one example, the system may receive a set of instructions for data evaluation, evaluate the set of data via the LLM, and obtain a set of output data from the LLM. In another example, the system may receive a prompt template for the LLM, execute the prompt template via the LLM, obtain a set of output data from the LLM, and evaluate the performance of the prompt template via the LLM.
    Type: Application
    Filed: November 19, 2025
    Publication date: May 21, 2026
    Inventors: Manjeet Singh, Jonathon Neal Moore, Avi Shah, Deepak Mukunthu, Nabil Naffar, Magic Johnson, Sky Chen, Reddy Yerradoddi
  • Patent number: 12632442
    Abstract: A computing services environment may include application servers providing computing services including access to a database system, a unified metadata framework including autonomous agent definitions referencing action definitions defining a plurality of actions capable of being performed within the computing services environment, an agent service configured to instantiate an autonomous agent instance based on an autonomous agent definition, and an orchestration layer configured to determine an orchestration plan based on novel planning text generated by a generative language model. The orchestration plan may include a subset of the plurality of actions identified in the novel planning text. The computing services environment may execute the subset of the plurality of actions within the computing services environment.
    Type: Grant
    Filed: January 27, 2025
    Date of Patent: May 19, 2026
    Assignee: Salesforce, Inc.
    Inventors: Prithvi Krishnan Padmanabhan, Robert Van Osten, Sky Chen, Nelson Wong, Bharat Suri, Atul Chandrakant Kshirsagar
  • Publication number: 20260079823
    Abstract: A computing services environment may include application servers providing computing services including access to a database system, a unified metadata framework including autonomous agent definitions referencing action definitions defining a plurality of actions capable of being performed within the computing services environment, an agent service configured to instantiate an autonomous agent instance based on an autonomous agent definition, and an orchestration layer configured to determine an orchestration plan based on novel planning text generated by a generative language model. The orchestration plan may include a subset of the plurality of actions identified in the novel planning text. The computing services environment may execute the subset of the plurality of actions within the computing services environment.
    Type: Application
    Filed: January 27, 2025
    Publication date: March 19, 2026
    Inventors: Sky CHEN, Nabil NAFFAR, Magic JOHNSON, Reddy YERRADODDI, Roshan DAVIS, Ning YANG, Shipra GUPTA, Prithvi Krishnan PADMANABHAN, Atul Chandrakant KSHIRSAGAR
  • Publication number: 20260079914
    Abstract: A computing services environment may include application servers providing computing services including access to a database system, a unified metadata framework including autonomous agent definitions referencing action definitions defining a plurality of actions capable of being performed within the computing services environment, an agent service configured to instantiate an autonomous agent instance based on an autonomous agent definition, and an orchestration layer configured to determine an orchestration plan based on novel planning text generated by a generative language model. The orchestration plan may include a subset of the plurality of actions identified in the novel planning text. The computing services environment may execute the subset of the plurality of actions within the computing services environment.
    Type: Application
    Filed: January 27, 2025
    Publication date: March 19, 2026
    Inventors: Prithvi Krishnan PADMANABHAN, Robert VAN OSTEN, Sky CHEN, Nelson WONG, Bharat SURI, Atul Chandrakant KSHIRSAGAR
  • Publication number: 20260031257
    Abstract: The disclosure is directed to protection devices including a positive temperature coefficient (PTC) element having a first main side opposite a second main side, and a thermal device coupled to the PTC element by a conductive material. The thermal device may include a main body, a first heating element coupled to a first side of the main body, and a second heating element coupled to a second side of the main body, wherein the first heating element is directly coupled to the second main side of the PTC element.
    Type: Application
    Filed: July 24, 2025
    Publication date: January 29, 2026
    Applicant: Littelfuse, Inc.
    Inventors: Tao Guo, TongKiang Poo, Sky Chen, Bing Wang
  • Publication number: 20250336576
    Abstract: A three-dimensional electrode for a reflowable PTC device is provided. The three-dimensional electrode can include a planar portion for connecting with a PTC material on a top surface thereof or a bottom surface thereof, at least one expander portion electrically and physically connected with and perpendicular with the planar portion, and one or more terminals electrically and physically connected with the at least one expander portion, wherein the at least one expander portion can vertically or horizontally offset the one or more terminals from the planar portion.
    Type: Application
    Filed: April 22, 2025
    Publication date: October 30, 2025
    Applicant: Littelfuse, Inc.
    Inventors: ChiHao Ku, Yu Tian, Garrett Wang, Sky Chen, Bing Wang
  • Publication number: 20240389199
    Abstract: A positive temperature coefficient (PTC) heater including a PTC layer formed of a material exhibiting a non-linear change in resistance in response to changes in temperature, an electrode layer including first and second electrodes disposed atop the PTC layer, each of the first and second electrodes including a spine and a plurality of tines extending inwardly therefrom, with the spine of the first electrode oriented parallel to the spine of the second electrode and with the tines of the first electrode disposed in an interdigitated relationship with the tines of the second electrode, an adhesive layer including first and second adhesive strips disposed atop the spines of the first and second electrodes, respectively, and a busbar layer including first and second busbars disposed atop the first and second adhesive strips, respectively, and adhered to the spines of the first and second electrodes by the first and second adhesive strips, respectively.
    Type: Application
    Filed: May 6, 2024
    Publication date: November 21, 2024
    Applicant: Littelfuse, Inc.
    Inventors: Jun Gang Wang, Yu Tian, ChiHao Ku, Sky Chen
  • Publication number: 20240371549
    Abstract: A pre-charge circuit. The precharge circuit may include a switching device for controlling a voltage to be supplied to a battery; and a heterogeneous thermistor circuit, coupled to the switching device. The heterogeneous thermistor circuit may include a negative temperature coefficient (NTC) component; and a polymer positive temperature coefficient (PPTC) component, arranged in electrical series with the NTC component and the switching device.
    Type: Application
    Filed: May 1, 2024
    Publication date: November 7, 2024
    Applicant: Littelfuse, Inc.
    Inventors: Tao Guo, TongKiang Poo, Jianhua Chen, Sky Chen
  • Publication number: 20210249298
    Abstract: A height adjustable semiconductor wafer support is provided. The height adjustable semiconductor wafer support includes a chuck for supporting a semiconductor wafer, an adjustment mechanism having a top surface for supporting the chuck, and a stage coupled to the adjustment mechanism such that movement of the top surface of the adjustment mechanism relative to the stage changes a distance between the top surface of the adjustment mechanism and a top surface of the stage.
    Type: Application
    Filed: February 11, 2020
    Publication date: August 12, 2021
    Inventors: Ming Shing LIN, Yichi YEN, Sky CHEN, Gwo-Lun LOU