Patents by Inventor Skye Hui-Hsin WU

Skye Hui-Hsin WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10170820
    Abstract: A wireless communication circuit and an electronic device are provided. The wireless communication circuit used for an electronic device includes a wireless transceiver unit used to generate a transmitting signal, an impedance matching unit electronically coupled to the wireless transceiver unit, a coupling unit and a system grounding surface. The impedance matching unit includes at least one impedance, the impedance matching unit is used to convert the transmitting signal to a feeding signal according to the impedance value of at least one impedance. The coupling unit is electronically coupled to the impedance matching unit, to radiate the energy of the feeding signal. The system grounding surface is used to transmit a first electromagnetic wave signal via resonance on the plane of the system grounding surface after receiving the energy of the feeding signal.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: January 1, 2019
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Shih-Chia Chiu, Shih-Yuan Chen, Skye Hui-Hsin Wu, Chien-Hao Chiu, Wang-Ta Hsieh, Wei-Hsin Shih
  • Publication number: 20170201006
    Abstract: A wireless communication circuit and an electronic device are provided. The wireless communication circuit used for an electronic device includes a wireless transceiver unit used to generate a transmitting signal, an impedance matching unit electronically coupled to the wireless transceiver unit, a coupling unit and a system grounding surface. The impedance matching unit includes at least one impedance, the impedance matching unit is used to convert the transmitting signal to a feeding signal according to the impedance value of at least one impedance. The coupling unit is electronically coupled to the impedance matching unit, to radiate the energy of the feeding signal. The system grounding surface is used to transmit a first electromagnetic wave signal via resonance on the plane of the system grounding surface after receiving the energy of the feeding signal.
    Type: Application
    Filed: December 29, 2016
    Publication date: July 13, 2017
    Inventors: Shih-Chia CHIU, Shih-Yuan CHEN, Skye Hui-Hsin WU, Chien-Hao CHIU, Wang-Ta HSIEH, Wei-Hsin SHIH