Abstract: Embodiments of the present disclosure are directed towards a memory device insertable into a PCB, e.g., a motherboard of a computing device. In some embodiments, the memory device may include a first PCB having a first thickness, to house one or more memory modules disposed on at least one side of the first PCB. The memory device may further include a layer having a second thickness, which may be attached to the side of the first PCB in an area that is proximate to an edge of the first PCB, to form a memory device portion that may be insertable into a connector slot disposed on a second PCB. The insertable portion may have a thickness that comprises the first and second thicknesses, to fit into the connector slot of the second PCB. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the present disclosure are directed towards a memory device insertable into a PCB, e.g., a motherboard of a computing device. In some embodiments, the memory device may include a first PCB having a first thickness, to house one or more memory modules disposed on at least one side of the first PCB. The memory device may further include a layer having a second thickness, which may be attached to the side of the first PCB in an area that is proximate to an edge of the first PCB, to form a memory device portion that may be insertable into a connector slot disposed on a second PCB. The insertable portion may have a thickness that comprises the first and second thicknesses, to fit into the connector slot of the second PCB. Other embodiments may be described and/or claimed.