Patents by Inventor Slva Natarajan

Slva Natarajan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structure of a thermally and electrically enhanced plastic pin grid array (PPGA) package for high performance devices with wire bond interconnect
    Patent number: 5625166
    Abstract: An integrated circuit package that contains a multi-layer printed circuit board that is coupled to a plurality of external mounting pins and an integrated circuit. The multi-layered circuit board has a plurality of inner bonding pads that are coupled to the integrated circuit and routed directly to the pins without use of any vias. The printed circuit board has multiple voltage/ground layers so that different power levels can be supplied to the integrated circuit board. The integrated circuit is mounted and electrically grounded to a heat slug that is also coupled to the printed circuit board. The heat slug provides the dual function of a ground plane and a thermal sink for the package. The pins and package are typically configured in a conventional PPGA package arrangement.
    Type: Grant
    Filed: November 1, 1994
    Date of Patent: April 29, 1997
    Assignee: Intel Corporation
    Inventor: Slva Natarajan