Patents by Inventor Smita Bais-Singh

Smita Bais-Singh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • NONWOVEN BONDING PATTERNS PRODUCING FABRICS WITH IMPROVED ABRASION RESISTANCE AND SOFTNESS
    Publication number: 20110144608
    Abstract: A thermal bonding pattern for a nonwoven fabric possessing improved abrasion resistance while retaining softness, comprising a basket-weave pattern or other pattern having a transition area (2) equal to at least 10% of bonding spot area (1) in FIG. 3, more preferably a transition area (2) equal to at least 50% of bonding spot area (1), and most preferably a transition area (2) equal to at least 100% of bonding spot area.
    Type: Application
    Filed: February 8, 2011
    Publication date: June 16, 2011
    Applicant: AHLSTROM CORPORATION
    Inventors: Kyuk Hyun Kim, Valeria G. Erdos, Smita Bais-Singh
  • Nonwoven bonding patterns producing fabrics with improved abrasion resistance and softness
    Patent number: 7914723
    Abstract: A thermal bonding pattern for nonwoven fabric possessing improved abrasion resistance while retaining softness, comprising a basket-weave pattern or other pattern having a transition area (2) equal to at least 10% of bonding spot area (1) in FIG. 3, more preferably a transition area (2) equal to at least 50% of bonding spot area (1), and most preferably a transition area (2) equal to at least 100% of bonding spot area.
    Type: Grant
    Filed: April 24, 2007
    Date of Patent: March 29, 2011
    Assignee: Ahlstrom Corporation
    Inventors: Kyuk Hyun Kim, Valeria G. Erdos, Smita Bais-Singh
  • NONWOVEN BONDING PATTERNS PRODUCING FABRICS WITH IMPROVED ABRASION RESISTANCE AND SOFTNESS
    Publication number: 20080268194
    Abstract: A thermal bonding pattern for nonwoven fabric possessing improved abrasion resistance while retaining softness, comprising a basket-weave pattern or other pattern having a transition area (2) equal to at least 10% of bonding spot area (1) in FIG. 1, more preferably a transition area (2) equal to at least 50% of bonding spot area (1), and most preferably a transition area (2) equal to at least 100% of bonding spot area.
    Type: Application
    Filed: April 24, 2007
    Publication date: October 30, 2008
    Inventors: Kyuk Hyun Kim, Valeria G. Erdos, Smita Bais-Singh