Patents by Inventor Smith J. Johnson

Smith J. Johnson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Backside IC device preparation process
    Patent number: 6518074
    Abstract: An integrated circuit backside preparation process back-thins a die using a dry etch process. A wet etch process decaps the integrated circuit to expose the die. After polishing, the prepared integrated circuit is ready for a backside debug analysis.
    Type: Grant
    Filed: September 28, 2000
    Date of Patent: February 11, 2003
    Assignee: National Semiconductor Corporation
    Inventors: Hiep V. Nguyen, Henry Acedo, Smith J. Johnson, Kevin Weaver