Patents by Inventor Smolko Dan

Smolko Dan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Permeation layer attachment chemistry and method
    Publication number: 20050158451
    Abstract: Electronically addressable microchips having covalently bound permeation layers and methods of making such covalently bonded permeation layers to microchips are provided. The covalent bonding is derived from combining the use of electrodes with silane derivatives. Such chemistry provides the ability to apply an electronic bias to the electrodes of the microchip while preventing permeation layer delaminating from the electrode surface. Methods for covalently attaching the permeation layer to the microchips are also described.
    Type: Application
    Filed: December 23, 2004
    Publication date: July 21, 2005
    Inventors: Havens John, Theodore Winger, Jain Krotz, Smolko Dan, Thomas Onofrey
  • Platinum silicide permeation layer device with microlocaions
    Patent number: 6838053
    Abstract: Electronically addressable microchips having covalently bound permeation layers and methods of making such covalently bonded permeation layers to microchips are provided. The covalent bonding is derived from combining the use of electrodes with silane derivatives. Such chemistry provides the ability to apply an electronic bias to the electrodes of the microchip while preventing permeation layer delaminating from the electrode surface.
    Type: Grant
    Filed: August 3, 2001
    Date of Patent: January 4, 2005
    Assignee: Nanogen, Inc.
    Inventors: Havens R. John, Theodore M. Winger, Jain Krotz, Smolko Dan, Thomas J. Onofrey
  • Permeation layer attachment chemistry and method
    Publication number: 20020015993
    Abstract: Electronically addressable microchips having covalently bound permeation layers and methods of making such covalently bonded permeation layers to microchips are provided. The covalent bonding is derived from combining the use of electrodes with silane derivatives. Such chemistry provides the ability to apply an electronic bias to the electrodes of the microchip while preventing permeation layer delaminating from the electrode surface.
    Type: Application
    Filed: August 3, 2001
    Publication date: February 7, 2002
    Inventors: Havens R. John, Theodore M. Winger, Jain Krotz, Smolko Dan, Thomas J. Onofrey
  • Permeation layer attachment chemistry and method
    Patent number: 6303082
    Abstract: Electronically addressable microchips having covalently bound permeation layers and methods of making such covalently bonded permeation layers to microchips are provided. The covalent bonding is derived from combining the use of electrodes with silane derivatives. Such chemistry provides the ability to apply an electronic bias to the electrodes of the microchip while preventing permeation layer delaminating from the electrode surface.
    Type: Grant
    Filed: December 15, 1999
    Date of Patent: October 16, 2001
    Assignee: Nanogen, Inc.
    Inventors: Havens R. John, Theodore M. Winger, Jain Krotz, Smolko Dan, Thomas J. Onofrey