Patents by Inventor Smoon Lin

Smoon Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for applying solder mask onto pad spacings of a printed circuit board
    Publication number: 20050042852
    Abstract: A method for applying the solder mask onto solder pad spacings of a printed circuit board, mainly referring to the use of an ink-jet printer for printing the solder mask at the dense solder pad area on a printed circuit board, so as to prevent the solder mask from being coated onto solder pads in the dense solder pad area, thus improving the reliability of assembling processes for electronic products, and further providing merits of minimizing clearances between the solder mask and solder pads and increasing the adhesion of the solder mask.
    Type: Application
    Filed: August 19, 2003
    Publication date: February 24, 2005
    Applicant: Unitech Printed Circuit Board Corp.
    Inventors: Cheng-Hsien Chou, Hung-Yi Yeh, Smoon Lin