Patents by Inventor So Chee Chung

So Chee Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for packaging circuits
    Patent number: 8138617
    Abstract: Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the periphery of a die. The edge contacts are positioned in the saw streets. Each edge contact is connected to one bond pad of each die adjacent the saw street. The edge contact is divided into contacts for each adjacent die when the dies are separated. In an embodiment, a recess is formed in the saw street. In an embodiment, the recess is formed by scribing the saw street with a mechanical cutter. The recess is patterned and contact material is deposited to form the edge contacts.
    Type: Grant
    Filed: August 30, 2004
    Date of Patent: March 20, 2012
    Assignee: Round Rock Research, LLC
    Inventors: Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Neo Yong Loo, Eng Meow Koon, Ser Bok Leng, Chua Swee Kwang, So Chee Chung, Ho Kwok Seng
  • Apparatus and method for packaging circuits
    Patent number: 8115306
    Abstract: An apparatus comprises an integrated circuit die including a main body having a top layer, a bottom layer, and a peripheral edge surface extending between the top layer and the bottom layer. The integrated circuit die also includes a bond pad on the main body, an edge contact at the peripheral edge surface and a line connecting the bond pad to the edge contact. The edge contact includes a bottom surface that substantially in the same plane as a surface of an encapsulant encasing the die. Additional apparatus, systems, and methods are disclosed.
    Type: Grant
    Filed: February 12, 2010
    Date of Patent: February 14, 2012
    Assignee: Round Rock Research, LLC
    Inventors: Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Neo Yong Lou, Eng Meow Koon, Ser Bok Leng, Chun Swee Kwang, So Chee Chung, Ho Kwok Song
  • APPARATUS AND METHOD FOR PACKAGING CIRCUITS
    Publication number: 20100140794
    Abstract: An apparatus comprises an integrated circuit die including a main body having a top layer, a bottom layer, and a peripheral edge surface extending between the top layer and the bottom layer. The integrated circuit die also includes a bond pad on the main body, an edge contact at the peripheral edge surface and a line connecting the bond pad to the edge contact. The edge contact includes a bottom surface that substantially in the same plane as a surface of an encapsulant encasing the die. Additional apparatus, systems, and methods are disclosed.
    Type: Application
    Filed: February 12, 2010
    Publication date: June 10, 2010
    Inventors: Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Neo Yong Lou, Eng Meow Koon, Ser Bok Leng, Chun Swee Kwang, So Chee Chung, Ho Kwok Song
  • Apparatus and method for packaging circuits
    Patent number: 7675169
    Abstract: Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the periphery of a die. The edge contacts are positioned in the saw streets. Each edge contact is connected to one bond pad of each die adjacent the saw street. The edge contact is divided into contacts for each adjacent die when the dies are separated. In an embodiment, a recess is formed in the saw street. In an embodiment, the recess is formed by scribing the saw street with a mechanical cutter. The recess is patterned and contact material is deposited to form the edge contacts.
    Type: Grant
    Filed: November 2, 2007
    Date of Patent: March 9, 2010
    Assignee: Micron Technology, Inc.
    Inventors: Chia Yong Poo, Boon Suan Jeung, Low Slu Waf, Chan Min Yu, Neo Yong Loo, Eng Meow Koon, Ser Bok Leng, Chua Swee Kwang, So Chee Chung, Hu Kwok Seng
  • Method for fabricating packaged die
    Patent number: 7358154
    Abstract: Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the periphery of a die. The edge contacts are positioned in the saw streets. Each edge contact is connected to one bond pad of each die adjacent the saw street. The edge contact is divided into contacts for each adjacent die when the dies are separated. In an embodiment, a recess is formed in the saw street. In an embodiment, the recess is formed by scribing the saw street with a mechanical cutter. The recess is patterned and contact material is deposited to form the edge contacts.
    Type: Grant
    Filed: November 17, 2005
    Date of Patent: April 15, 2008
    Assignee: Micron Technology, Inc.
    Inventors: Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Neo Yong Loo, Eng Meow Koon, Ser Bok Leng, Chua Swee Kwang, So Chee Chung, Ho Kwok Seng
  • Apparatus and method for packaging circuits
    Patent number: 6894386
    Abstract: Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the periphery of a die. The edge contacts are positioned in the saw streets. Each edge contact is connected to one bond pad of each die adjacent the saw street. The edge contact is divided into contacts for each adjacent die when the dies are separated. In an embodiment, a recess is formed in the saw street. In an embodiment, the recess is formed by scribing the saw street with a mechanical cutter. The recess is patterned and contact material is deposited to form the edge contacts.
    Type: Grant
    Filed: April 8, 2002
    Date of Patent: May 17, 2005
    Assignee: Micron Technology, Inc.
    Inventors: Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Neo Yong Loo, Eng Meow Koon, Ser Bok Leng, Chua Swee Kwang, So Chee Chung, Ho Kwok Seng
  • Apparatus and method for packaging circuits
    Publication number: 20030067001
    Abstract: Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the periphery of a die. The edge contacts are positioned in the saw streets. Each edge contact is connected to one bond pad of each die adjacent the saw street. The edge contact is divided into contacts for each adjacent die when the dies are separated. In an embodiment, a recess is formed in the saw street. In an embodiment, the recess is formed by scribing the saw street with a mechanical cutter. The recess is patterned and contact material is deposited to form the edge contacts.
    Type: Application
    Filed: April 8, 2002
    Publication date: April 10, 2003
    Applicant: Micron Technology, Inc.
    Inventors: Chin Yong Poo, Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Neo Yong Loo, Eng Meow Koon, Ser Bok Leng, Chua Swee Kwang, So Chee Chung, Ho Kwok Seng