Patents by Inventor So Chung

So Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ANTI-DOPPEL ANTIBODY DRUG CONJUGATES
    Publication number: 20240091372
    Abstract: Described are anti-doppel antibody-drug conjugates, compositions comprising them, and related methods of treating doppel-associated diseases and conditions, including cancer.
    Type: Application
    Filed: July 18, 2023
    Publication date: March 21, 2024
    Applicants: SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION, OSONG MEDICAL INNOVATION FOUNDATION
    Inventors: Youngro BYUN, Ha Kyeong LEE, Seungwoo CHUNG, Byoung Mo KIM, So-Young CHOI, Se-Ra LEE
  • APPARATUS AND METHOD FOR PACKAGING CIRCUITS
    Publication number: 20080054423
    Abstract: Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the periphery of a die. The edge contacts are positioned in the saw streets. Each edge contact is connected to one bond pad of each die adjacent the saw street. The edge contact is divided into contacts for each adjacent die when the dies are separated. In an embodiment, a recess is formed in the saw street. In an embodiment, the recess is formed by scribing the saw street with a mechanical cutter. The recess is patterned and contact material is deposited to form the edge contacts.
    Type: Application
    Filed: November 2, 2007
    Publication date: March 6, 2008
    Inventors: Chia Poo, Boon Jeung, Low War, Chan Yu, Nao Loo, Eng Koon, Ser Leng, Chua Kwang, So Chung, Hu Seng
  • Apparatus and method for packaging circuits
    Publication number: 20060084240
    Abstract: Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the periphery of a die. The edge contacts are positioned in the saw streets. Each edge contact is connected to one bond pad of each die adjacent the saw street. The edge contact is divided into contacts for each adjacent die when the dies are separated. In an embodiment, a recess is formed in the saw street. In an embodiment, the recess is formed by scribing the saw street with a mechanical cutter. The recess is patterned and contact material is deposited to form the edge contacts.
    Type: Application
    Filed: November 17, 2005
    Publication date: April 20, 2006
    Inventors: Chia Poo, Boon Jeung, Low Waf, Chan Yu, Neo Loo, Eng Koon, Ser Leng, Chua Kwang, So Chung, Ho Seng
  • Apparatus and method for packaging circuits
    Publication number: 20050029668
    Abstract: Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the periphery of a die. The edge contacts are positioned in the saw streets. Each edge contact is connected to one bond pad of each die adjacent the saw street. The edge contact is divided into contacts for each adjacent die when the dies are separated. In an embodiment, a recess is formed in the saw street. In an embodiment, the recess is formed by scribing the saw street with a mechanical cutter. The recess is patterned and contact material is deposited to form the edge contacts.
    Type: Application
    Filed: August 30, 2004
    Publication date: February 10, 2005
    Inventors: Chia Poo, Boon Jeung, Low Waf, Chan Yu, Neo Loo, Eng Koon, Ser Leng, Chua Kwang, So Chung, Ho Seng