Patents by Inventor So Hyeon HONG

So Hyeon HONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250145841
    Abstract: A method for manufacturing a conductive paste, includes: an operation of forming a first mixture including a metal powder, a dispersant, and a hydrophobic solvent; an operation of forming a second mixture including a hydrophilic binder and a hydrophilic solvent; and an operation of forming a third mixture by mixing the first and second mixtures.
    Type: Application
    Filed: January 14, 2025
    Publication date: May 8, 2025
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Gyun Kwon, Eung Seok Lee, So Hyeon Hong, Byung Rok Ahn
  • Patent number: 12227672
    Abstract: A method for manufacturing a multilayer ceramic capacitor including an operation of preparing a ceramic green sheet; an operation of forming a conductive paste on the ceramic green sheet; an operation of forming a ceramic laminate by stacking a ceramic green sheet on which the conductive paste is formed; an operation of sintering the ceramic laminate; and an operation of forming an external electrode on an exterior of the ceramic laminate, wherein the conductive paste includes a first mixture including a metal powder, a dispersant, and a hydrophobic solvent and a second mixture including a hydrophilic binder and a hydrophilic solvent, the conductive paste being an emulsion in which the first mixture is dispersed in the second mixture.
    Type: Grant
    Filed: December 23, 2021
    Date of Patent: February 18, 2025
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Gyun Kwon, Eung Seok Lee, So Hyeon Hong, Byung Rok Ahn
  • Publication number: 20240177930
    Abstract: A dielectric slurry composition according to an embodiment of the present disclosure includes: a first solution including a hydrophobic solvent and dielectric particles; and a second solution containing a hydrophilic solvent, a hydrophilic dispersant, and a hydrophilic binder, wherein at least a portion of the first solution has an emulsion structure in the second solution.
    Type: Application
    Filed: April 5, 2023
    Publication date: May 30, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Gyun KWON, So Hyeon HONG, Eung Seok LEE
  • Publication number: 20240161977
    Abstract: A method of manufacturing a multilayer electronic component including: a first operation of obtaining a layer pattern constituting one layer by performing at least one of a process of forming a dielectric pattern by ejecting a ceramic ink containing a dielectric material and a photocurable resin, a process of forming an internal electrode pattern by ejecting a first metal ink containing conductive particles for internal electrodes and a photocurable resin, and a process of forming external electrode patterns by ejecting a second metal ink containing conductive particles for external electrodes and a photocurable resin; a second operation of obtaining a cured layer pattern by irradiating the layer pattern with ultraviolet light to cure the layer pattern; obtaining a laminate in which a plurality of cured layer patterns are stacked by carrying out a plurality of the first and second operations; and sintering the laminate.
    Type: Application
    Filed: February 15, 2023
    Publication date: May 16, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Eung Seok LEE, Tae Gyun KWON, So Hyeon HONG
  • Publication number: 20230115369
    Abstract: A manufacturing method of a capacitor component includes: forming a dielectric green sheet and inkjet printing a conductive pattern on the dielectric green sheet. The inkjet printing the conductive pattern includes inkjet printing a base pattern on the dielectric green sheet; and inkjet printing a reinforcing pattern on at least a portion of each of both end portions of the base pattern in a width direction of the dielectric green sheet.
    Type: Application
    Filed: December 27, 2021
    Publication date: April 13, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Eung Seok Lee, Tae Gyun Kwon, So Hyeon Hong, Tae Sung Kim
  • Publication number: 20230098422
    Abstract: A method for manufacturing a conductive paste, includes: an operation of forming a first mixture including a metal powder, a dispersant, and a hydrophobic solvent; an operation of forming a second mixture including a hydrophilic binder and a hydrophilic solvent; and an operation of forming a third mixture by mixing the first and second mixtures.
    Type: Application
    Filed: December 23, 2021
    Publication date: March 30, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Gyun Kwon, Eung Seok Lee, So Hyeon Hong, Byung Rok Ahn
  • Patent number: 11600441
    Abstract: A multilayer electronic component includes a body including dielectric layers and internal electrodes. The internal electrodes are exposed to fifth and sixth surfaces of the body, and first ends thereof are respectively exposed to third or fourth surfaces of the body. First and second side margin portions are respectively disposed on the fifth and sixth surfaces. The body includes an active portion, and upper and lower cover portions disposed respectively on a first surface and a second surface of the active portion in a first direction. The ratio of a dimension of the lower cover portion in the first direction C to a dimension of the first side margin portion in the third direction A, C/A?2.6, C/T is 0.080, where T is a dimension of the body in the first direction, and D<C where D is the dimension of the body in the first direction.
    Type: Grant
    Filed: April 5, 2021
    Date of Patent: March 7, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Min Kang, Ho Sam Choi, Jong Ho Lee, So Hyeon Hong
  • Patent number: 11551870
    Abstract: A multilayer ceramic electronic component includes: a ceramic body including an active portion having dielectric layers and first and second internal electrodes and first and second cover portions disposed on opposite surfaces of the active portion in a stacking direction, respectively; wherein when a region of the cover portion in contact with the first or second internal electrode is an inner region of the cover portion and a region of the active portion in contact with the inner region of the cover portion is an outer region of the active portion, 1.00<XA/XB?1.04 in which XA/XB is a ratio of a molar ratio (XA) of barium (Ba) to titanium (Ti) in the inner region of the cover portion to a molar ratio (XB) of barium (Ba) to titanium (Ti) in the outer region of the active portion.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: January 10, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyu Jeong Sim, Ho Sam Choi, Seung Min Kang, Jin Kyu Kim, Jae Won Kim, So Hyeon Hong, Jong Ho Lee, Chung Eun Lee
  • Publication number: 20220139622
    Abstract: A multilayer electronic component includes a body including dielectric layers and internal electrodes. The internal electrodes are exposed to fifth and sixth surfaces of the body, and first ends thereof are respectively exposed to third or fourth surfaces of the body. First and second side margin portions are respectively disposed on the fifth and sixth surfaces. The body includes an active portion, and upper and lower cover portions disposed respectively on a first surface and a second surface of the active portion in a first direction. The ratio of a dimension of the lower cover portion in the first direction C to a dimension of the first side margin portion in the third direction A, C/A?2.6, C/T is 0.080, where T is a dimension of the body in the first direction, and D<C where D is the dimension of the body in the first direction.
    Type: Application
    Filed: April 5, 2021
    Publication date: May 5, 2022
    Inventors: Seung Min KANG, Ho Sam CHOI, Jong Ho LEE, So Hyeon HONG
  • Publication number: 20220139624
    Abstract: A multilayer ceramic electronic component includes: a ceramic body including an active portion having dielectric layers and first and second internal electrodes and first and second cover portions disposed on opposite surfaces of the active portion in a stacking direction, respectively; wherein when a region of the cover portion in contact with the first or second internal electrode is an inner region of the cover portion and a region of the active portion in contact with the inner region of the cover portion is an outer region of the active portion, 1.00<XA/XB<1.04 in which XA/XB is a ratio of a molar ratio (XA) of barium (Ba) to titanium (Ti) in the inner region of the cover portion to a molar ratio (XB) of barium (Ba) to titanium (Ti) in the outer region of the active portion.
    Type: Application
    Filed: August 10, 2021
    Publication date: May 5, 2022
    Inventors: Kyu Jeong SIM, Ho Sam CHOI, Seung Min KANG, Jin Kyu KIM, Jae Won KIM, So Hyeon HONG, Jong Ho LEE, Chung Eun LEE