Patents by Inventor So Hyun JI

So Hyun JI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer supporting structure
    Patent number: 11322382
    Abstract: A wafer supporting structure according to an aspect of the present disclosure includes a supporting body, a first strained layer disposed on an upper portion of the supporting body and having a first thermal expansion rate, and a second strained layer disposed on a lower portion of the supporting body and having a second thermal expansion rate different from the first thermal expansion rate. One of the first strained layer and the second strained layer is configured to receive a working wafer thereon.
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: May 3, 2022
    Assignee: SK hynix Inc.
    Inventor: So Hyun Ji
  • WAFER SUPPORTING STRUCTURE
    Publication number: 20210111060
    Abstract: A wafer supporting structure according to an aspect of the present disclosure includes a supporting body, a first strained layer disposed on an upper portion of the supporting body and having a first thermal expansion rate, and a second strained layer disposed on a lower portion of the supporting body and having a second thermal expansion rate different from the first thermal expansion rate. One of the first strained layer and the second strained layer is configured to receive a working wafer thereon.
    Type: Application
    Filed: June 18, 2020
    Publication date: April 15, 2021
    Applicant: SK hynix Inc.
    Inventor: So Hyun JI