Abstract: A coil component includes: a body; a coil unit disposed in the body; external electrodes disposed on the body and connected to the coil unit; and a surface insulating layer disposed on the body, and including inorganic fillers with fluorine coating layers formed on surfaces thereof.

Abstract: The exemplary embodiments relate generally to a display device that may include: a first substrate and a second substrate, each including a transparent encapsulation area; an outer sealant along a side of the transparent encapsulation area; a pattern part disposed on the first substrate and extending in a direction parallel to the outer sealant; and a transparent sealant adjacent to the pattern part and extending in a direction parallel to the pattern part, and a manufacturing method thereof.

Abstract: A multilayer chip bead includes: a body including a coil portion and cover layers disposed on upper and lower surfaces of the coil portion; first and second external electrodes disposed on external surfaces of the body; and a coil disposed in the coil portion, including coil patterns having a spiral shape and lead patterns, and having both end portions connected to the first and second external electrodes, respectively, through the lead patterns. A width of the lead pattern is smaller than that of the coil pattern.

Abstract: The exemplary embodiments relate generally to a display device that may include: a first substrate and a second substrate, each including a transparent encapsulation area; an outer sealant along a side of the transparent encapsulation area; a pattern part disposed on the first substrate and extending in a direction parallel to the outer sealant; and a transparent sealant adjacent to the pattern part and extending in a direction parallel to the pattern part, and a manufacturing method thereof.

Abstract: The exemplary embodiments relate generally to a display device that may include: a first substrate and a second substrate, each including a transparent encapsulation area; an outer sealant along a side of the transparent encapsulation area; a pattern part disposed on the first substrate and extending in a direction parallel to the outer sealant; and a transparent sealant adjacent to the pattern part and extending in a direction parallel to the pattern part, and a manufacturing method thereof.

Abstract: A multilayer bead includes a body in which a plurality of ceramic layers are stacked; a plurality of internal electrode patterns formed on the plurality of ceramic layers; and first and second external electrodes formed on both end surfaces of the body and electrically connected to both ends of an internal coil formed by a combination of the plurality of internal electrode patterns, respectively. A stacking direction of the plurality of ceramic layers is parallel to both end surfaces of the body on which the first and second external electrodes are formed, and a coil axis of the internal coil is parallel to a mounting surface of the body. A board having the multilayer bead may be provided.

Abstract: A multilayer chip bead includes: a body including a coil portion and cover layers disposed on upper and lower surfaces of the coil portion; first and second external electrodes disposed on external surfaces of the body; and a coil disposed in the coil portion, including coil patterns having a spiral shape and lead patterns, and having both end portions connected to the first and second external electrodes, respectively, through the lead patterns. A width of the lead pattern is smaller than that of the coil pattern.

Abstract: The exemplary embodiments relate generally to a display device that may include: a first substrate and a second substrate, each including a transparent encapsulation area; an outer sealant along a side of the transparent encapsulation area; a pattern part disposed on the first substrate and extending in a direction parallel to the outer sealant; and a transparent sealant adjacent to the pattern part and extending in a direction parallel to the pattern part, and a manufacturing method thereof.

Abstract: A multilayer electronic component may include: a multilayer body including a plurality of insulating layers; an internal coil part provided by electrically connecting respective conductive patterns disposed on the plurality of insulating layers to each other; and first and second external electrodes disposed on both end surfaces of the multilayer body, respectively. A perimeter of at least one conductive pattern disposed in peripheral regions of the multilayer body may be smaller than a perimeter of a conductive pattern disposed in a central region of the multilayer body.

Abstract: A multilayer electronic component may include: a multilayer body including a plurality of insulating layers; an internal coil part provided by electrically connecting respective conductive patterns disposed on the plurality of insulating layers to each other; and first and second external electrodes disposed on both end surfaces of the multilayer body, respectively. A perimeter of at least one conductive pattern disposed in peripheral regions of the multilayer body may be smaller than a perimeter of a conductive pattern disposed in a central region of the multilayer body.