Abstract: Methods and apparatus for verifying alignment between an opaque shadow ring and a substrate are provided. In some embodiments, the apparatus includes a tool comprising: a transparent ring having an inner edge defining a central opening and an outer edge and having a top side and a bottom side; a gauge mark on or in the transparent ring spaced between the inner edge and the outer edge, the gauge mark extending around the inner edge; and a pin extending from the bottom side of the transparent ring and located between the gauge mark and the outer edge.

Abstract: Methods and systems for monitoring wafer processing results continuously and in real-time. In some embodiments, a system may comprise at least one non-active chamber with at least one feedthrough access port which is configured to interact with a metrology apparatus. The feedthrough access port has a surface exposed to an inner volume of the non-active chamber and has a fluorine-based coating covering the surface. The non-active chamber has a wafer access port to one or more other chambers. The metrology apparatus is positioned external to the non-active chamber and is oriented to detect metrology data through one of the feedthrough access ports. A data collection apparatus is connected to the metrology apparatus and configured to continuously receive data from the metrology apparatus.