Abstract: A MEMS package includes an interconnect structure disposed on a wafer. A first device substrate including a first MEMS device and a second device substrate including a second MEMS device are laterally separated from each other, disposed on the wafer and bonded to the interconnect structure. A first cap substrate with a first cavity is bonded to the first device substrate. A second cap substrate with a second cavity is bonded to the second device substrate. A getter is disposed on the interconnect structure and directly under the second MEMS device. The first cavity has a first pressure, and the second cavity has a second pressure lower than the first pressure.

Abstract: A microelectromechanical systems (MEMS) package includes a first MEMS package and a second MEMS package laterally spaced apart from the first MEMS package. The first MEMS package includes a first device substrate including a first MEMS device, a first cap substrate bonded to the first device substrate, where the first cap substrate encloses a first cavity and a vent hole connected to the first cavity. A first sealing layer is filled in the vent hole, where the first sealing layer is disposed between the first device substrate and the first cap substrate. The second MEMS package includes a second device substrate including a second MEMS device and a second cap substrate. The second cap substrate is bonded to the second device substrate and encloses a second cavity. The first cavity has a first pressure, and the second cavity have a second pressure different from the first pressure.

Abstract: A micro-electro-mechanical system (MEMS) device includes a supporting substrate, a cavity disposed in the supporting substrate, a stopper, and a MEMS structure. The stopper is disposed between the supporting substrate and the cavity, and an inner sidewall of the stopper is in contact with the cavity. The stopper includes a filling material surrounding a periphery of the cavity, and a liner wrapping around the filling material. The MEMS structure is disposed over the cavity and attached on the stopper and the supporting substrate.