Abstract: A target volume evacuation system includes a turbo compressor and a vacuum pump, the system being operable in a first configuration to reduce the target volume pressure from ambient to a first intermediate pressure, e.g. between 200 mbar and 50 mbar, and in a second configuration to further reduce the pressure from a second intermediate pressure, e.g. 10 mBar, to a target partial vacuum, e.g. between 0.1 and 1 mbar. The turbo compressor can be driven electrically or by fuel combustion, and can be a conventional or modified turbojet engine. A plurality of turbo compressors can be transitioned from parallel to series operation. The pressure can be reduced from the first to the second intermediate pressure by venting the target volume to a boom-tank volume and/or by configuring the turbo compressor system to provide backing to the vacuum pumping system. The invention is applicable to a hyperloop transport system.

Abstract: A target volume evacuation system includes a turbo compressor and a vacuum pump, the system being operable in a first configuration to reduce the target volume pressure from ambient to a first intermediate pressure, e.g. between 200 mbar and 50 mbar, and in a second configuration to further reduce the pressure from a second intermediate pressure, e.g. 10 mBar, to a target partial vacuum, e.g. between 0.1 and 1 mbar. The turbo compressor can be driven electrically or by fuel combustion, and can be a conventional or modified turbojet engine. A plurality of turbo compressors can be transitioned from parallel to series operation. The pressure can be reduced from the first to the second intermediate pressure by venting the target volume to a boom-tank volume and/or by configuring the turbo compressor system to provide backing to the vacuum pumping system. The invention is applicable to a hyperloop transport system.

Abstract: The method and device are used to plasma-treat workpieces. The workpiece is inserted into a chamber of a treatment station that can be at least partially evacuated. The plasma chamber is bounded by a chamber bottom, a chamber cover, and a lateral chamber wall. The method process is optically monitored at least at times. In the optical monitoring, spectral lines of the radiation of the plasma above 500 nanometers are evaluated. Preferably, the evaluation is performed for frequencies above 700 nanometers.

Abstract: A device for plasma treatment of workpieces. The workpiece is placed into a chamber of a processing station that can be at least partially evacuated. The plasma chamber is bounded by a chamber floor, a chamber cover, and a side chamber wall. The plasma chamber is coupled to a device for feeding and/or discharging process gases in a controlled manner. The plasma chamber is further disposed on a rotatable plasma wheel supported on a static base. At least one process gas channel is disposed in the region of the base, bounded at least in regions by a cover. The cover is implemented as part of the plasma wheel and includes at least one connection opening to the process gas channel. The connection opening can be coupled to an inner chamber by a connecting channel and at least one control valve.

Abstract: The method and device are used to plasma-treat workpieces. The workpiece is inserted into a chamber of a treatment station that can be at least partially evacuated. The plasma chamber is bounded by a chamber bottom, a chamber cover, and a lateral chamber wall. The method process is optically monitored at least at times. In the optical monitoring, spectral lines of the radiation of the plasma above 500 nanometers are evaluated. Preferably, the evaluation is performed for frequencies above 700 nanometers.

Abstract: The device serves for the plasma treatment of workpieces. The workpiece is placed in the chamber of a treatment station which can at least partially be evacuated. The plasma chamber is defined by a chamber bottom, a chamber cover, as well as a lateral chamber wall, and has a positionable gas lance. The gas lance is constructed at least partially of a dielectric.

Abstract: The invention relates to a method and a device for supplying at least one vacuum machining station. A first part of a supply device is arranged on a rotatable carrier element and is guided in such a way that it can be displaced in relation to a fixed second part of the supply device. A gap extends at least partially between the first part and the second part of the supply device, said gap being at least partially unsealed from the environment.