Abstract: An electronic component includes: a body including a dielectric layer and internal electrodes, and including first to sixth surfaces; a first external electrode including a connection portion on the third surface, and first and third band portions respectively on the first and second surfaces; a second external electrode including a connection portion on the fourth surface, and second and fourth band portions respectively on the first and second surfaces; an insulating layer disposed on the connection portions, and covering the second surface and the third and fourth band portions; plating layers respectively disposed on the first and second band portions; and first and second additional electrode layers respectively disposed between the connection portion and the third surface and between the connection portion and the fourth surface. The first or second external electrode includes copper. The first or second additional electrode layer includes one of nickel and an alloy of nickel.

Abstract: A multilayer electronic component includes a body and first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion disposed on the third surface, and a first band portion extending from the first connection portion to a portion of the first surface; a second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion to a portion of the first surface; an insulating layer disposed on the second surface and extending to the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion, wherein the insulating layer includes an oxide including silicon (Si).

Abstract: An electronic component includes: a body including a dielectric layer and internal electrodes, and including first to sixth surfaces; a first external electrode including a connection portion on the third surface, and first and third band portions respectively on the first and second surfaces; a second external electrode including a connection portion on the fourth surface, and second and fourth band portions respectively on the first and second surfaces; an insulating layer disposed on the connection portions, and covering the second surface and the third and fourth band portions; plating layers respectively disposed on the first and second band portions; and first and second additional electrode layers respectively disposed between the connection portion and the third surface and between the connection portion and the fourth surface. The first or second external electrode includes copper. The first or second additional electrode layer includes one of nickel and an alloy of nickel.

Abstract: A multilayer electronic component includes a body and first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion disposed on the third surface, and a first band portion extending from the first connection portion to a portion of the first surface; a second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion to a portion of the first surface; an insulating layer disposed on the second surface and extending to the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion, wherein the insulating layer includes an oxide including silicon (Si).