Abstract: In one aspect of the present disclosure, there is provided a low-density curable composition precursor, comprising (a) a first part (A) comprising: (i) at least one polymeric diamine; (b) a second part (B) comprising: (i) at least one epoxy resin; (ii) at least one reactive diluent; (iii) at least one amide selected from polyamide waxes; wherein part (A) and/or part (B) comprise a low density filler material having a density of less than 0.3 g/cc; and wherein the curable composition obtained by combining part (A) and part (B) has a cured density according to DIN 53479A of less than 0.5 g/cc.

Abstract: Provided is a curative part usable in a two-part curable composition. The curative part includes a liquid amine; a heterogeneous dispersant; and core-shell rubber particles having an elastomeric core and a (meth)acrylic shell. The core-shell rubber particles and the heterogeneous dispersant can be collectively shear-dispersed in the liquid amine such that the core-shell rubber particles are substantially non-aggregated and the curative part is phase-stable over a period of at least 3 months at ambient temperature. Advantageously, large amounts of core-shell rubber particles can thus be incorporated into a cured resin matrix, which can afford significantly enhanced impact performance.

Abstract: The present disclosure provides a two-part curable composition precursor comprising (a) a first part (A) comprising at least one multifunctional epoxy resin having an epoxy functionality of at least three; and (b) a second part (B) comprising a prepolymer obtained from (i) a first amine-based epoxy curing agent and a second amine-based epoxy curing agent distinct from the first amine-based epoxy curing agent and (ii) at least one epoxy resin.

Abstract: A curable coating composition precursor comprising: (a) a first part (A) comprising (i) at least one amine epoxy curing agent based on a phenolic lipid, and (ii) inorganic microspheres; and (b) a second part (B) comprising (i) at least one epoxy resin, (ii) optionally, at least one reactive diluent, (iii) at least one epoxy reactive flexibilizer, and (iv) inorganic microspheres. The curable coating composition precursor comprises at least one fire retardant compound in part (A) and/or part (B), and the curable coating composition obtained by combining part (A) and part (B) has a density of less than 0.7 g/cm3.

Abstract: Provided is a curative part usable in a two-part curable composition. The curative part includes a liquid amine; a heterogeneous dispersant; and core-shell rubber particles having an elastomeric core and a (meth)acrylic shell. The core-shell rubber particles and the heterogeneous dispersant can be collectively shear-dispersed in the liquid amine such that the core-shell rubber particles are substantially non-aggregated and the curative part is phase-stable over a period of at least 3 months at ambient temperature. Advantageously, large amounts of core-shell rubber particles can thus be incorporated into a cured resin matrix, which can afford significantly enhanced impact performance.

Abstract: A curable adhesive composition precursor comprising a first part (A) comprising: at least one diamine in an amount of from 10 to 50 wt.-% based on the total weight of part (A), at least one amine epoxy curing agent based on a phenolic lipid in an amount of from 10 to 50 wt.-% based on the total weight of part (A), and at least one inorganic filler material in an amount of from 10 to 60 wt.-% based on the total amount of part (A); and a second part (B) comprising: at least one first epoxy resin in an amount of from 15 to 60 wt.-% based on the total amount of part (B)), at least one viscosity modifier in an amount of from 1 to 25 wt.-%, based on the total weight of part (B), and at least one epoxy-reactive flexibilizer in an amount of from 0.1 to 10 wt.-% based on the total amount of part (B).

Abstract: The present disclosure relates to a thermosettable structural adhesive composition comprising an epoxy compound; a thermoplastic compound; an epoxy curing agent; at least one mineral filler, wherein the at least one mineral filler is capable of absorbing water. The thermosettable structural adhesive composition can exhibit an improved corrosion resistance while also providing good adhesive properties such as good t-peel strength and overlap shear strength.

Abstract: A curable void filler composition comprising at least one epoxy resin; at least one epoxy curing agent comprising at least one bicyclic carboxylic acid anhydride; and at least one epoxysilane compound according to formula (1), where formula (1) is Glycidoxy-R1Si(OR2)(OR3)(OR4), and R1 is selected from linear or branched alkyl comprising from 1 and 15 carbon atoms; and R2, R4 and R4 may be different or the same, and are independently selected from linear or branched alkyl comprising from 2 to 15 carbon atoms.

Abstract: A thermosettable precursor of an expanded structural adhesive composition comprising: an epoxy compound; an epoxy curing agent; an expanding agent; and a mineral pigment selected from the group of phosphate metal complexes. In addition, a method of bonding two parts and to uses of the thermosettable precursor of an expanded structural adhesive composition.

Abstract: The present disclosure provides a curable void filler composition comprising: (a) at least one epoxy resin; (b) at least one epoxy curing agent comprising a carboxylic acid anhydride compound; (c) at least one alkaline oxide and/or at least one alkaline earth oxide.

Abstract: The present disclosure is directed to a curable composition comprising: a) an epoxy resin; b) an epoxy curing agent comprising at least one cycloaliphatic amine; c) at least 3 wt % of a metal triflate catalyst; d) optionally, a fatty acid polyamide; and e) optionally, a filler material. The compositions of the present disclosure are particularly suitable for use in structural assembly, in particular for potting and filling operations in sandwich structures. The present disclosure also relates to a composite assembly and to methods of using such epoxy resin based curable compositions.

Abstract: A curable coating composition precursor comprising: (a) a first part (A) comprising (i) at least one amine epoxy curing agent based on a phenolic lipid, and (ii) inorganic microspheres; and (b) a second part (B) comprising (i) at least one epoxy resin, (ii) optionally, at least one reactive diluent, (iii) at least one epoxy reactive flexibilizer, and (iv) inorganic microspheres. The curable coating composition precursor comprises at least one fire retardant compound in part (A) and/or part (B), and the curable coating composition obtained by combining part (A) and part (B) has a density of less than 0.7 g/cm3.

Abstract: The invention relates to the use of a structural adhesive film for bonding and sealing a hem flange connection between panels. The structural adhesive film comprises at least one adhesive layer and at least one layer with a porous structure. The adhesive layer comprise an epoxy compound as well as an epoxy curing agent.

Abstract: The present disclosure provides a curable void filler composition comprising: (a) at least one epoxy resin; (b) at least one epoxy curing agent comprising a carboxylic acid anhydride compound; (c) at least one alkaline oxide and/or at least one alkaline earth oxide.

Abstract: The present disclosure is directed to a precursor composition for a curable adhesive, the precursor comprising: a) a part (A) comprising: i. a first epoxy curing agent comprising at least one polyether amine and having an amine equivalent weight of at least 45 grams per mole of amine equivalents; ii. a second epoxy curing agent distinct from the first epoxy curing agent or a secondary curative; iii. a metal nitrate catalyst; iv. optionally, a metal triflate catalyst; and b) a part (B) comprising: i. a multifunctional first epoxy resin having at least three functional groups; ii. a second epoxy resin distinct from the first epoxy resin; iii. a core-shell polymer toughening agent iv. a filler material; and v. optionally, an epoxy-based reactive diluent. The compositions of the present disclosure are particularly suitable for use in structural bonding applications, in particular for adhesively bonding parts in manufacturing operations in aeronautic and aerospace industries.

Abstract: Epoxy curatives and two-part compositions comprising epoxy curative and epoxy resin parts are provided as well as methods of their use in liquid shim applications. Epoxy curatives comprise at least one cycloaliphatic polyamine curative and at least one second curative selected from a) an aliphatic polyamidoamine and b) an adduct of an excess of an unbranched polyetherdiamine with an epoxy resin.

Abstract: An epoxy curative is provided comprising: a) a Lewis base, b) calcium nitrate, and c) a polyamine amide salt. The present disclosure additionally provides a composition which is a mixture obtained by mixing the epoxy curative and a curable epoxy resin. The present disclosure additionally provides cured compositions which result from cure of such a mixture.

Abstract: Curable adhesive compositions comprising vi. a curable epoxy resin vii. an amine curing agent, viii. a polymeric toughening agent, ix. a filler and x. a phosphoric acid ester according to the formula as an adhesion promoter, wherein R represents an aliphatic or aromatic residue that contains one or more carboxylic acid ester units and/or one or more urethane units and that further contains at least one ether group and n represents an integer of 1 or 2, methods of making them, bonded articles and methods for bonding.

Abstract: The present disclosure relates to a thermosettable structural adhesive composition comprising an epoxy compound; a thermoplastic compound; an epoxy curing agent; at least one mineral filler, wherein the at least one mineral filler is capable of absorbing water. The thermosettable structural adhesive composition can exhibit an improved corrosion resistance while also providing good adhesive properties such as good t-peel strength and overlap shear strength.

Abstract: The invention relates to the use of a structural adhesive film for bonding and sealing a hem flange connection between panels. The structural adhesive film comprises at least one adhesive layer and at least one layer with a porous structure. The adhesive layer comprise an epoxy compound as well as an epoxy curing agent.