Abstract: A method of producing a sputter target assembly including a metal target attached to a metal-matrix-composite backing plate and sputter target assemblies made thereby. The method includes hot isostatically pressing a silicon carbide-aluminum powder composition to form a backing plate while simultaneously bonding the powder composition to a metal target to form a diffusion-type bond between the target and the backing plate such that the target assembly possesses extremely high resistance to warpage at high operating temperatures. A second embodiment of the sputter target assembly includes an annular sealing member of machined aluminum disposed in the backing plate around the target.

Abstract: A cathode sputtering assembly includes a sputter target welded to a corresponding backing member, where the target and backing member are adapted for insertion into a sputtering system. The target has a reduced diameter portion profiled for receipt within a counterbored upper section of the backing member. The target has a beveled surface above the reduced diameter section, and the backing member has an upper tapered edge, where the interface between the sputtering target and the backing member cooperate to define a V-groove. Both the target and the backing member are comprised of aluminum and the target and backing member are TIG welded together with aluminum filler rod.