Abstract: A glass, substantially not including an alkali metal oxide and BaO, and including, in terms of mol % on the basis of oxides, 40 to 44% of SiO2, 15 to 23% of MgO, 28 to 36% of CaO, and 5 to 10% of Al2O3, in which a total content of SiO2, MgO, CaO, and Al2O3 is 97% or more, in which a molar ratio of CaO content to MgO content represented by CaO/MgO is 1.2 to 2.3.

Abstract: It is an object to provide a glass composition in which foaming due to a reaction with a nitride film is suppressed. A glass composition contains, in mole percentage based on following oxides, 30% to 90% of TeO2, 0% to 60% of ZnO, 0% to 24% of B2O3, 0% to 8% of Li2O+Na2O+K2O, 0% to 8% of Al2O3, 0% to 17% of Bi2O3, 0% to 30% of V2O5, and 0% to 10% of SiO2; and does not substantially contain any of components which includes F, Pb, Cd, W, Mo, Ag, or Gd.

Abstract: When local heating by use of laser sealing or the like is applied, the bonding strength between glass substrates and a sealing layer is improved to provide an electronic device having increased reliability. An electronic device includes a first glass substrate, a second glass substrate, and a sealing layer to seal an electronic element portion disposed between these glass substrates. The sealing layer is a layer obtained by locally heating a sealing material by an electromagnetic wave, such as laser light or infrared light, to melt-bond the sealing material, the sealing material containing sealing glass, a low-expansion filler and an electromagnetic wave absorber. In the first and second glass substrates, each reacted layer is produced to have a maximum depth of at least 30 nm from an interface with the sealing layer.

Abstract: The invention provides a glass member provided with a sealing material layer, which suppresses generation of failures such as cracks or breakage of glass substrates or a sealing layer even when the distance between two glass substrates is narrowed, and thereby makes it possible to improve the sealing property between the glass substrates and its reliability. A glass substrate has a surface provided with a sealing region, on which a sealing material layer having a thickness of at most 15 ?m is formed. The sealing material layer includes a fired material of a glass material for sealing containing a sealing glass, a laser absorbent and optionally a low-expansion filler, wherein the total content of the laser absorbent and the low-expansion filler being the optional component in the glass material for sealing is within the range of from 2 to 44 vol %.

Abstract: To provide a process for producing an airtight member, which can improve bonding property of a sealing layer to a highly thermally conductive substrate and reliability, in airtight sealing of a space between a glass substrate and a highly thermally conductive substrate by local heating by electromagnetic waves. A glass substrate having a sealing material layer having electromagnetic wave absorbing property provided on a sealing region, and a highly thermally conductive substrate having a glass layer formed on a sealing region, are laminated while the sealing material layer and the glass layer are brought into contact with each other. The sealing material layer is irradiated with electromagnetic waves through the glass substrate to heat and melt the sealing material layer thereby to bond it to the glass layer, so as to form a sealing layer which airtightly seals the space between the glass substrate and the thermally conductive substrate.

Abstract: To provide a process for producing a glass member provided with a sealing material layer, capable of forming a sealing material layer well even in a case where the entire glass substrate cannot be heated. A sealing material layer is formed by scanning and irradiating with a laser light 9 along a frame-form coating layer 8 of a sealing material paste on a glass substrate. The scanning speed with the laser light 9 in a finishing region from a position close to an irradiation finishing position which at least partially overlaps with an already fired portion of the frame-form coating layer 8 to the irradiation finishing position, is adjusted to be slower than the scanning speed with the laser light in a scanning region along the frame-form coating layer 8.

Abstract: A glass substrate 3 has a surface 3a provided with a sealing region. On the sealing region of the glass substrate 3, a sealing material layer 9 having a thickness of less than 7 ?m is formed. The sealing material layer 9 is made of a fired layer of a glass material for sealing which contains a sealing glass and an inorganic filler containing a laser absorbent, wherein the content of the inorganic filler is from 2 to 44 vol %. The surface area of the inorganic filler in the glass material for sealing is within a range of more than 6 m2/cm3 and less than 14 m2/cm3. The difference between the thermal expansion coefficient ?1 of the sealing material layer 9 and the thermal expansion coefficient ?2 of the glass substrate 3 is within a range of from 15 to 70(×10?7/° C.).

Abstract: When local heating by use of laser sealing or the like is applied, the bonding strength between glass substrates and a sealing layer is improved to provide an electronic device having increased reliability. An electronic device includes a first glass substrate, a second glass substrate, and a sealing layer to seal an electronic element portion disposed between these glass substrates. The sealing layer is a layer obtained by locally heating a sealing material by an electromagnetic wave, such as laser light or infrared light, to melt-bond the sealing material, the sealing material containing sealing glass, a low-expansion filler and an electromagnetic wave absorber. In the first and second glass substrates, each reacted layer is produced to have a maximum depth of at least 30 nm from an interface with the sealing layer.

Abstract: The invention seeks to increase the sealing property and the reliability of an electronic device by suppressing cracks, fractures and the like of a glass substrate at the time of laser sealing. A glass substrate 3 has a sealing region. On the sealing region, a sealing material layer 5 comprising a glass material for sealing containing a low-expansion filler and a laser absorbent is provided. The glass material for sealing contains no low-expansion filler particles having particle sizes exceeding the thickness T of the sealing material layer 5 and contains low-expansion filler particles having particle sizes within a range of from 0.5T to 1T based on the thickness T of the sealing material layer 5 in a volume ratio of from 0.1 to 50%. Such a glass substrate 3 and a glass substrate 2 having an element-formed region provided with an electronic element are laminated, and the sealing material layer 5 is irradiated with a laser light 6 and melted to bond the glass substrates 2 and 3.

Abstract: The present invention relates to a glass laminate including: a thin glass substrate having a first main surface and a second main surface; a supporting glass substrate having a first main surface and a second main surface, provided such that the first main surface thereof faces the first main surface of the thin glass substrate; a resin layer formed between the thin glass substrate and the supporting glass substrate, fixed to the first main surface of the supporting glass substrate and closely adhered to the first main surface of the thin glass substrate with peelability to the first main surface thereof; and an outer frame layer containing a glass sealing material and being formed by firing at an outer side of a peripheral part of the resin layer.

Abstract: The invention provides a glass member provided with a sealing material layer, which suppresses generation of failures such as cracks or breakage of glass substrates or a sealing layer even when the distance between two glass substrates is narrowed, and thereby makes it possible to improve the sealing property between the glass substrates and its reliability. A glass substrate has a surface provided with a sealing region, on which a sealing material layer having a thickness of at most 15 ?m is formed. The sealing material layer includes a fired material of a glass material for sealing containing a sealing glass, a laser absorbent and optionally a low-expansion filler, wherein the total content of the laser absorbent and the low-expansion filler being the optional component in the glass material for sealing is within the range of from 2 to 44 vol %.

Abstract: The bonding strength to a glass substrate comprising soda lime glass is increased with good reproducibility at a time of laser sealing, to improve the sealing ability and the reliability of an electronic device. A glass substrate 3 has a sealing region. On the sealing region, a sealing material layer 5 is provided, which is a fired layer of a glass material for sealing containing a sealing glass, a low-expansion filler and a laser absorbent. The sealing glass contains, as represented by mass percentage, from 70 to 90% of Bi2O3, from 1 to 20% of ZnO, from 2 to 12% of B2O3 and from 10 to 380 ppm of Na2O. Such a glass substrate 3 and a glass substrate 2 having an element-formed region provided with an electronic element, are laminated, the sealing material layer 5 is irradiated with a laser light 6 to be melted to bond the glass substrates 2 and 3.

Abstract: To increase the sealing property and the reliability of an electronic device by suppressing cracks, fractures and the like of a glass substrate at the time of laser sealing. A glass substrate 3 has a sealing region. On the sealing region, a sealing material layer 5 comprising a glass material for sealing containing a low-expansion filler and a laser absorbent is provided. The glass material for sealing contains no low-expansion filler particles having particle sizes exceeding the thickness T of the sealing material layer 5 and contains low-expansion filler particles having particle sizes within a range of from 0.5 T to 1 T based on the thickness T of the sealing material layer 5 in a volume ratio of from 0.1 to 50%. Such a glass substrate 3 and a glass substrate 2 having an element-formed region provided with an electronic element are laminated, and the sealing material layer 5 is irradiated with a laser light 6 and melted to bond the glass substrates 2 and 3.

Abstract: Laser sealing property and reliability of a glass panel are increased by suppressing cracks, fractures, separation and the like of glass substrates and a sealing material layer at the time of laser sealing. A first paste for a sealing material containing no laser absorbent and a second paste for a sealing material containing a laser absorbent are applied in this order on a sealing region 2a of a glass substrate 2. A laminate film of a coating layer 11 of the first paste for a sealing material and a coating layer 12 of the second paste for a sealing material is fired, to form a sealing material layer 3 having a laminated structure of a layer 4 of the first glass material for sealing and a layer 5 of the second glass material for sealing.