Patents by Inventor Sohei Samejima
Sohei Samejima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9313903Abstract: A method of manufacturing a printed wiring board (10) includes the steps of: forming a core including carbon fiber reinforced plastic having a primary through hole (3a); forming a first adhesive member (4a) on a lower surface of the core to cover the primary through hole (3a); charging an insulating member into the primary through hole (3a); forming a second adhesive member (4b) on an upper surface of the core; forming a third adhesive member (6a) below the first adhesive member (4a); forming a fourth adhesive member (6b) on the second adhesive member (4b); and forming interconnections on the core.Type: GrantFiled: December 24, 2009Date of Patent: April 12, 2016Assignee: Mitsubishi Electric CorporationInventors: Sohei Samejima, Tsuyoshi Ozaki, Hiroyuki Osuga, Teruhiko Kumada
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Publication number: 20160066431Abstract: A method of manufacturing a printed wiring board (10) includes the steps of: forming a core including carbon fiber reinforced plastic having a primary through hole (3a); forming a first adhesive member (4a) on a lower surface of the core to cover the primary through hole (3a); charging an insulating member into the primary through hole (3a); forming a second adhesive member (4b) on an upper surface of the core; forming a third adhesive member (6a) below the first adhesive member (4a); forming a fourth adhesive member (6b) on the second adhesive member (4b); and forming interconnections on the core.Type: ApplicationFiled: November 11, 2015Publication date: March 3, 2016Applicant: Mitsubishi Electric CorporationInventors: Sohei SAMEJIMA, Tsuyoshi OZAKI, Hiroyuki OSUGA, Teruhiko KUMADA
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Publication number: 20150336335Abstract: Provided is a method of producing a fiber-reinforced composite material, involving impregnating a fiber structure with a resin by using the pressure difference between a vacuum pressure and an atmospheric pressure and thereafter curing the resin, the method comprising: impregnating a mixture of a bromine-containing resin 22 and a powdered flame retardant 21 that contains at least one component selected from aluminum hydroxide and magnesium hydroxide and has an average particle size in the range of 0.1 to 20 ?m into a fiber structure 10 that has a mode value for the size of fiber surrounded individual openings in the range of 0.03 to 3 mm2 and an opening area percentage in the range of 0.1 to 10%, from a surface direction of the fiber structure 10, to unevenly distribute the powdered flame retardant 21 in a surface layer of the fiber structure 10. The present invention can simply and conveniently produce a highly flame-retardant and lightweight fiber-reinforced composite material that exhibits a high strength.Type: ApplicationFiled: January 9, 2013Publication date: November 26, 2015Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Tatsuya OKAWA, Kazuki KUBO, Yuhei AWANO, Takahiro MABUCHI, Sohei SAMEJIMA, Michihito MATSUMOTO
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Patent number: 9144942Abstract: The present invention is a method for producing a fiber-reinforced plastic molding including, in the following order, the steps of: forming a preform laminate fixed to a molding die by laminating a plurality of preforms each including a dry fiber fabric and a fixing resin, the preforms being laminated through the fixing resin formed on a surface of the dry fiber fabric and including a partially-cured thermosetting resin exhibiting tackiness at a room temperature; impregnating the dry fiber fabric, provided in the preform laminate fixed to the molding die, with a liquid thermosetting resin; curing the liquid thermosetting resin and the fixing resin to form a fiber-reinforced plastic molding; and demolding the fiber-reinforced plastic molding from the molding die.Type: GrantFiled: May 12, 2011Date of Patent: September 29, 2015Assignee: Mitsubishi Electric CorporationInventors: Sohei Samejima, Hajime Takeya, Michihito Matsumoto, Kazuki Kubo, Yuhei Awano, Takahiro Mabuchi
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Publication number: 20150084242Abstract: A cover for an air conditioning device for a railway vehicle is a cover for an air conditioning device for a vehicle, which covers an air-conditioner main body. The cover includes a core made of a foamed material having heat insulating property, and a surface member made of a fiber reinforced plastic, which covers entire surfaces of the core. The core is deformed into a curved shape by elastic deformation.Type: ApplicationFiled: May 14, 2013Publication date: March 26, 2015Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Hiroki Kobayashi, Shinsuke Okano, Kosuke Umemura, Hajime Takeya, Masami Kume, Sohei Samejima, Michihito Matsumoto
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Patent number: 8935851Abstract: A method of manufacturing a circuit board includes: forming a first through hole in a core material; forming a first conductive film on an inner wall of the first through hole; forming an insulating layer on both surfaces of the core material and in the first through hole; forming a second through hole in the insulating layer in the first through hole; forming a second conductive film on an inner wall of the second through hole; and forming, on surfaces of the insulating layers formed on the both surfaces of the core material, a signal circuit layer electrically connected to the second conductive film.Type: GrantFiled: January 12, 2011Date of Patent: January 20, 2015Assignee: Mitsubishi Electric CorporationInventors: Sohei Samejima, Hajime Takeya, Hiroyuki Osuga
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Publication number: 20140261993Abstract: A method for producing a preform for manufacture of a fiber-reinforced plastic molding. The method includes: fixing a resin-equipped film rolled out from a roll state including a release film and a fixing resin and containing a partially-cured thermosetting resin, to a surface of the dry fiber fabric rolled out from a roll with the fixing resin interposed therebetween, thereby obtaining a first dry fiber fabric; separately fixing the resin-equipped film to a surface of the dry fiber fabric rolled out from a roll with the fixing resin interposed therebetween, and detaching the release film, thereby obtaining one or more second dry fiber fabrics; and laminating the second dry fiber fabrics on a surface of the first dry fiber fabric with the fixing resin of the second dry fiber fabrics interposed therebetween.Type: ApplicationFiled: September 6, 2012Publication date: September 18, 2014Applicant: Mitsubishi Electric CorporationInventors: Sohei Samejima, Hajime Takeya, Michihito Matsumoto, Hiroki Kobayashi, Kazuki Kubo, Yuhei Awano, Takahiro Mabuchi
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Publication number: 20130177727Abstract: The present invention is a method for producing a fiber-reinforced plastic molding including, in the following order, the steps of: forming a preform laminate (5b) fixed to a molding die (6) by laminating a plurality of preforms (5a) each including a dry fiber fabric (4) and a fixing resin (2), the preforms being laminated through the fixing resin (2) formed on a surface of the dry fiber fabric and including a partially-cured thermosetting resin exhibiting tackiness at a room temperature; impregnating the dry fiber fabric (4), provided in the preform laminate (5b) fixed to the molding die (6), with a liquid thermosetting resin (11); curing the liquid thermosetting resin (11) and the fixing resin (2) to form a fiber-reinforced plastic molding; and demolding the fiber-reinforced plastic molding from the molding die (6).Type: ApplicationFiled: May 12, 2011Publication date: July 11, 2013Applicant: Mitsubishi Electric CorporationInventors: Sohei Samejima, Hajime Takeya, Michihito Matsumoto, Kazuki Kubo, Yuhei Awano, Takahiro Mabuchi
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Publication number: 20130008700Abstract: On a printed wiring board obtained by a method of manufacturing a printed board, a predetermined component is to be mounted on at least one of a front surface side and a back surface side. The manufacturing method includes preparing a CFRP core, forming a through hole so as to penetrate the CFRP core from the front surface side to the back surface side and include a region in which the component is to be mounted when viewed in a plan view, and embedding a GFRP core having insulating properties within the through hole by filling the through hole with a resin having insulating properties and curing the resin. According to the manufacturing method, the component mounted on the printed board is not affected by a stray capacitance due to a CFRP, and it is not difficult to form a circuit.Type: ApplicationFiled: February 23, 2011Publication date: January 10, 2013Applicants: NIPPON AVIONICS, CO., LTD., Mitsubishi Electric CorporationInventors: Hiroyuki Osuga, Sohei Samejima, Kazuhito Sakurada, Akira Yagasaki, Tatsuya Hinata
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Publication number: 20120279765Abstract: A method of manufacturing a circuit board includes: forming a first through hole in a core material; forming a first conductive film on an inner wall of the first through hole; forming an insulating layer on both surfaces of the core material and in the first through hole; forming a second through hole in the insulating layer in the first through hole; forming a second conductive film on an inner wall of the second through hole; and forming, on surfaces of the insulating layers formed on the both surfaces of the core material, a signal circuit layer electrically connected to the second conductive film.Type: ApplicationFiled: January 12, 2011Publication date: November 8, 2012Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Sohei Samejima, Hajime Takeya, Hiroyuki Osuga
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Patent number: 8134085Abstract: A CFRP core including a CFRP layer has a primary through hole. An adhesive member coats a wall surface of the primary through hole, and has a secondary through hole extending within the primary through hole. An electrically conductive layer is formed on a wall surface of the secondary through hole for electrically connecting upper and lower signal interconnections via the secondary through hole. A coating layer coats an outer peripheral edge of the CFRP core as seen in a plan view. Thereby, a printed interconnection board with low thermal expansivity and high thermal conductivity capable of preventing exfoliation of a CFRP layer on a side surface of a substrate using CFRP as a core, as well as preventing falling-off of carbon powders from the CFRP layer, and a method of manufacturing the same can be obtained.Type: GrantFiled: October 28, 2008Date of Patent: March 13, 2012Assignee: Mitsubishi Electric CorporationInventors: Sohei Samejima, Sadao Sato, Tsuyoshi Ozaki, Hiroyuki Osuga, Teruhiko Kumada
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Publication number: 20110290408Abstract: A method of manufacturing a printed wiring board (10) includes the steps of: forming a core including carbon fiber reinforced plastic having a primary through hole (3a); forming a first adhesive member (4a) on a lower surface of the core to cover the primary through hole (3a); charging an insulating member into the primary through hole (3a); forming a second adhesive member (4b) on an upper surface of the core; forming a third adhesive member (6a) below the first adhesive member (4a); forming a fourth adhesive member (6b) on the second adhesive member (4b); and forming interconnections on the core.Type: ApplicationFiled: December 24, 2009Publication date: December 1, 2011Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Sohei Samejima, Tsuyoshi Ozaki, Hiroyuki Osuga, Teruhiko Kumada
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Publication number: 20090107702Abstract: A CFRP core including a CFRP layer has a primary through hole. An adhesive member coats a wall surface of the primary through hole, and has a secondary through hole extending within the primary through hole. An electrically conductive layer is formed on a wall surface of the secondary through hole for electrically connecting upper and lower signal interconnections via the secondary through hole. A coating layer coats an outer peripheral edge of the CFRP core as seen in a plan view. Thereby, a printed interconnection board with low thermal expansivity and high thermal conductivity capable of preventing exfoliation of a CFRP layer on a side surface of a substrate using CFRP as a core, as well as preventing falling-off of carbon powders from the CFRP layer, and a method of manufacturing the same can be obtained.Type: ApplicationFiled: October 28, 2008Publication date: April 30, 2009Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Sohei SAMEJIMA, Sadao Sato, Tsuyoshi Ozaki, Hiroyuki Osuga, Teruhiko Kumada