Abstract: Disclosed herein is a system for leveraging telemetry data representing usage of a component installed on a group of sampled computing devices to confidently infer the quality of a user experience and/or the behavior of the component (e.g., an operating system) on a larger group of unsampled computing devices. The system is configured to use a propensity score matching approach to identify a sampled computing device that best represents an unsampled computing device using configuration data that is collected from both the sampled and unsampled computing devices. The quality of the user experience and/or the behavior of the component may be captured by a metric of interest (e.g., a QoS value). Accordingly, the system is configured to use the known metric of interest, determined from the telemetry data collected for the sampled computing device, to determine or predict the metric of interest for the unsampled computing device.

Abstract: An ethylene interpolymer product comprises from 40 to 80 weight % of a first ethylene interpolymer having a molecular weight distribution index of Formula (I), and, from 20 to 60 weight % of a second ethylene interpolymer having a molecular weight distribution index of Formula (II), wherein said ethylene interpolymer product is characterized by a dilution Index, Yd, greater than 0, and, a solid-to-liquid transition temperature not greater than 112° C. The ethylene interpolymer product may be further characterized as having a weighted Rheological Adhesion Parameter, Rhadh, greater than 1.5. Films made from the ethylene interpolymer product composition have a hot tack seal onset temperature less than 90° C. and a hot tack window at 2.5N measured on a 2 mil blown film no less than 30° C.

Abstract: An all polyethylene multilayer film structure having alternating layers of (A) a linear low density polyethylene and (B) a high density polyethylene has improved performance properties relative to a film structure in which the (A) and (B) layers are arranged in a block like or random manner.

Abstract: This disclosure relates to ethylene interpolymer compositions and films prepared therefrom. Specifically: ethylene interpolymer products having: a dimensionless nonlinear rheology network parameter, ?int., greater than or equal to 0.01, satisfying 0.01×(Z?50)0.78??int.?0.01×(Z?60)0.78 inequality wherein Z is a normalized molecular weight defined by Z = M w M e where Mw and Me are the weight average and entanglement molecular weights, and; a residual catalytic metal of from ?0.03 to ?5 ppm of hafnium. The disclosed ethylene interpolymer products have a melt index from about 0.3 to about 500 dg/minute, a density from about 0.855 to about 0.975 g/cc, a polydispersity, M w M n , from about 1.7 to about 25 and a Composition Distribution Breadth Index (CDBI50) from about 1% to about 98%.

Abstract: This disclosure relates to ethylene interpolymer compositions and films prepared therefrom. Specifically: ethylene interpolymer products having: a dimensionless nonlinear rheology network parameter, ?int., greater than or equal to 0.01, satisfying 0.01×(Z?50)0.78??int.?0.01×(Z?60)0.78 inequality wherein Z is a normalized molecular weight defined by Z = M w M e where Mw and Me are the weight average and entanglement molecular weights, and; a residual catalytic metal of from ?0.03 to ?5 ppm of hafnium. The disclosed ethylene interpolymer products have a melt index from about 0.3 to about 500 dg/minute, a density from about 0.855 to about 0.975 g/cc, a polydispersity, M w M n , from about 1.7 to about 25 and a Composition Distribution Breadth Index (CDBI50) from about 1% to about 98%.

Abstract: This disclosure relates to ethylene interpolymer compositions and films prepared therefrom. Specifically: ethylene interpolymer products having: a dimensionless nonlinear rheology network parameter, ?int., greater than or equal to 0.01, satisfying 0.01×(Z?50)0.78??int.?0.01×(Z?60)0.78 inequality wherein Z is a normalized molecular weight defined by Z = M w M e where Mw and Me are the weight average and entanglement molecular weights, and; a residual catalytic metal of from ?0.03 to ?5 ppm of hafnium. The disclosed ethylene interpolymer products have a melt index from about 0.3 to about 500 dg/minute, a density from about 0.855 to about 0.975 g/cc, a polydispersity, M w M n , from about 1.7 to about 25 and a Composition Distribution Breadth Index (CDBI50) from about 1% to about 98%.

Abstract: This disclosure relates to ethylene interpolymer compositions and films prepared therefrom. Specifically: ethylene interpolymer products having: a dimensionless nonlinear rheology network parameter, ?int., greater than or equal to 0.01, satisfying 0.01×(Z?50)0.78??int.?0.01×(Z?60)0.78 inequality wherein Z is a normalized molecular weight defined by Z = M w M e where Mw and Me are the weight average and entanglement molecular weights, and; a residual catalytic metal of from ?0.03 to ?5 ppm of hafnium. The disclosed ethylene interpolymer products have a melt index from about 0.3 to about 500 dg/minute, a density from about 0.855 to about 0.975 g/cc, a polydispersity, M w M n , from about 1.7 to about 25 and a Composition Distribution Breadth Index (CDBI50) from about 1% to about 98%.