Abstract: A chemical mechanical polishing apparatus has a platen to support a polishing pad, the platen having a recess, a carrier head to hold a surface of a substrate against the polishing pad and comprising a retaining ring to retain the substrate below the carrier head, a motor to generate relative motion between the platen and the carrier head so as to polish the substrate, an in-situ acoustic monitoring system comprising an acoustic sensor arranged in the recess that receives acoustic energy from friction between the substrate and the polishing pad and from friction between the retaining ring and the polishing pad, and a controller configured to generate a value for a carrier head status parameter based on received acoustic signals from the in-situ acoustic monitoring system, and change or polishing parameter or generate an alert based on the carrier head status parameter.

Abstract: A chemical mechanical polishing apparatus includes a platen supporting a polishing pad, a carrier head to hold a surface of a substrate against the polishing pad, an acoustic sensor supported on the platen, and a motor to generate relative motion between the platen and the carrier head so as to polish the substrate. The carrier head includes a retaining ring for holding the substrate, and the acoustic sensor travels in a path below the carrier head and the retaining ring. A controller is configured to analyze a signal from the acoustic sensor and determine a characteristic of the retaining ring based on the signal.

Abstract: A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a conditioner head to hold a conditioner disk in contact with the polishing pad, a motor to generate relative motion between the polishing pad and the conditioner disk so as to condition the polishing pad, an in-situ acoustic monitoring system having an acoustic sensor to receive acoustic signals from the conditioner disk, and a controller configured to analyze a signal from the acoustic sensor and determine a characteristic of the conditioner disk or conditioner head based on the signal.

Abstract: A chemical mechanical polishing apparatus, including a platen supporting a polishing pad; a carrier head to hold a surface of a substrate against the polishing pad; a motor to generate relative motion between the platen and the carrier head so as to polish an overlying layer on the substrate; an array of acoustic sensors arranged within the carrier head to receive acoustic signals from the surface of the substrate; and a controller configured to detect a position of an acoustic event on the surface of the substrate based on received acoustic signals from the array of acoustic sensors.

Abstract: A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a carrier head to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier head so as to polish an overlying layer on the substrate, an in-situ acoustic monitoring system comprising an acoustic window having a top surface to contact the substrate, and a controller configured to detect a polishing endpoint based on received acoustic signals from the in-situ acoustic monitoring system.

Abstract: A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a carrier head to a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier head so as to polish an overlying layer on the substrate, an in-situ acoustic monitoring system, and a controller. The controller is configured to detect exposure of an underlying layer due to the polishing of the substrate based on measurements from the in-situ acoustic monitoring system. The in-situ acoustic monitoring system may detect exposure of an underlying layer based on comparison of the signal to prior measurements of acoustic signals generated by stress energy of test substrates.

Abstract: A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a carrier head to a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier head so as to polish an overlying layer on the substrate, an in-situ acoustic monitoring system, and a controller. The in-situ acoustic monitoring system includes an acoustic signal generator to emit acoustic signals and an acoustic signal sensor that receives acoustic signals reflected from the surface of the substrate. The controller is configured to detect exposure of an underlying layer due to the polishing of the substrate based on measurements from the in-situ acoustic monitoring system.