Patents by Inventor Sohyeon KIM

Sohyeon KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240172417
    Abstract: A semiconductor device includes a gate structure and a contact plug. The gate structure extends in a first direction parallel to the substrate, and includes a first conductive pattern, a second conductive pattern and a gate mask sequentially stacked. The contact plug contacts an end portion in the first direction of the gate structure, and includes a first extension portion extending in a vertical direction and contacting sidewalls of the gate mask and the second conductive pattern, a second extension portion under and contacting the first extension portion and a sidewall of the first conductive pattern, and a protrusion portion under and contacting the second extension portion. A bottom of the protrusion portion does not contact the first conductive pattern. A first slope of a sidewall of the first extension portion is greater than a second slope of a sidewall of the second extension portion.
    Type: Application
    Filed: January 23, 2024
    Publication date: May 23, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sohyeon BAE, Wonchul LEE, Jaehyun KIM, Jaehyuk JANG, Hyebin CHOI
  • Patent number: 11917812
    Abstract: A semiconductor device includes a gate structure and a contact plug. The gate structure extends in a first direction parallel to the substrate, and includes a first conductive pattern, a second conductive pattern and a gate mask sequentially stacked. The contact plug contacts an end portion in the first direction of the gate structure, and includes a first extension portion extending in a vertical direction and contacting sidewalls of the gate mask and the second conductive pattern, a second extension portion under and contacting the first extension portion and a sidewall of the first conductive pattern, and a protrusion portion under and contacting the second extension portion. A bottom of the protrusion portion does not contact the first conductive pattern. A first slope of a sidewall of the first extension portion is greater than a second slope of a sidewall of the second extension portion.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: February 27, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sohyeon Bae, Wonchul Lee, Jaehyun Kim, Jaehyuk Jang, Hyebin Choi
  • Publication number: 20230238684
    Abstract: A wearable device is provided. The wearable device includes a housing, an input member disposed on a lateral surface of the housing and including an outer lateral surface including a conductive portion and a non-conductive portion, a metal member disposed inside the housing and in contact with the conductive portion of the outer lateral surface, a printed circuit board (PCB) disposed on the metal member, a patch antenna including a conductive patch disposed on a surface of the PCB facing the input member at a location corresponding to the non-conductive portion, a wireless communication circuit electrically connected to the PCB and the patch antenna, and a processor connected to the metal member. The wireless communication circuit transmits a signal by feeding power to the patch antenna, and the processor acquires user biometric information through the metal member and the conductive portion of the input member.
    Type: Application
    Filed: February 24, 2023
    Publication date: July 27, 2023
    Inventors: Yongjoo SHIN, Donguk CHOI, Minhwa HONG, Sohyeon KIM
  • Publication number: 20230121035
    Abstract: A wearable electronic device according to an embodiment may include a metal frame forming at least a portion of a side surface of the wearable electronic device, a display mounted on the metal frame, a rear cover forming a rear surface of the wearable electronic device, a printed circuit board (PCB) disposed in a space formed by the rear cover and the metal frame, and a wireless communication circuit disposed on the PCB, wherein the wireless communication circuit feeds power to a first point of the metal frame, which having a first height from the rear cover, to receive a signal in a first frequency band, and feeds power to a second point of the metal frame, which has a second height from the rear cover that is higher than the first height to receive a signal in a second frequency band higher than the first frequency band.
    Type: Application
    Filed: December 15, 2022
    Publication date: April 20, 2023
    Inventors: Sewoong KIM, Woosuk KANG, Sohyeon KIM, Jeonghoon KIM, Jiwon KIM, Yoseb OH, Donguk CHOI, Minhwa HONG
  • Patent number: 11570407
    Abstract: Various embodiments relate to an electronic device that supports millimeter wave communication. The electronic device may include: a housing; an antenna structure including at least one antenna comprising a portion of the housing or positioned in the housing, and including an annular conductive structure comprising a conductive material, the annular conductive structure having a first surface facing an outside of the housing, a second surface facing a direction opposite the first surface, an internal space defined by the first surface and the second surface, and a plurality of slots having a repeating pattern and formed through the first surface to the internal space; a conductive member comprising a conductive material disposed in the internal space; a wireless communication circuit electrically connected with the conductive member and configured to form a directional beam using the antenna structure; and a ground electrically connected to the annular conductive structure.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: January 31, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yongjoo Shin, Sohyeon Kim, Inyoung Lee, Yuri Sin, Jiwoo Lee, Jaebong Chun
  • Publication number: 20200260051
    Abstract: Various embodiments relate to an electronic device that supports millimeter wave communication. The electronic device may include: a housing; an antenna structure including at least one antenna comprising a portion of the housing or positioned in the housing, and including an annular conductive structure comprising a conductive material, the annular conductive structure having a first surface facing an outside of the housing, a second surface facing a direction opposite the first surface, an internal space defined by the first surface and the second surface, and a plurality of slots having a repeating pattern and formed through the first surface to the internal space; a conductive member comprising a conductive material disposed in the internal space; a wireless communication circuit electrically connected with the conductive member and configured to form a directional beam using the antenna structure; and a ground electrically connected to the annular conductive structure.
    Type: Application
    Filed: November 27, 2019
    Publication date: August 13, 2020
    Inventors: Yongjoo SHIN, Sohyeon KIM, Inyoung LEE, Yuri SIN, Jiwoo LEE, Jaebong CHUN