Patents by Inventor Soi Chong Low

Soi Chong Low has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Marking semiconductor devices through a mount tape
    Patent number: 6972244
    Abstract: Wafer level techniques for marking the back surfaces of integrated circuit devices are described. The back surface of the wafer is laser marked while being supported by a mount tape. In some embodiments, the mount tape is sufficiently transparent that the laser light passes through the mount tape and marks the back surface of the wafer. In other embodiments, the laser may actually burn the mounting tape (or portions thereof) during the marking process. The marking may be done on any suitable back surface material including polymeric backcoatings, metalized films or directly on semiconductor materials.
    Type: Grant
    Filed: April 23, 2004
    Date of Patent: December 6, 2005
    Assignee: National Semiconductor Corporation
    Inventors: Viraj A. Patwardhan, Nikhil Vishwanath Kelkar, You Chye How, Tian Oon Goh, Soi Chong Low