Patents by Inventor Soichi Honma

Soichi Honma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device with improved encapsulating resin
    Patent number: 5959363
    Abstract: A semiconductor device comprising a wiring circuit board and a semiconductor chip mounted through a bump electrode on the circuit board, a space between the circuit board and the semiconductor chip as well as a periphery of the semiconductor chip being encapsulated with a resin containing a filler. The resin is constituted by a first resin disposed in a region surrounded by bump electrodes positioned on the outermost periphery of the semiconductor chip, and by a second resin disposed in a region not surrounded by bump electrodes positioned on the outermost periphery of the semiconductor chip, the first and second resins being distinct from each other in at least one feature selected from a content, a maximum particle diameter and an average particle diameter of the filler.
    Type: Grant
    Filed: June 9, 1998
    Date of Patent: September 28, 1999
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hiroshi Yamada, Takasi Togasaki, Masayuki Saito, Soichi Honma, Miki Mori, Kazuki Tateyama
  • Semiconductor device with improved encapsulating resin
    Patent number: 5864178
    Abstract: A semiconductor device comprising a wiring circuit board and a semiconductor chip mounted through a bump electrode on the circuit board, a space between the circuit board and the semiconductor chip as well as a periphery of the semiconductor chip being encapsulated with a resin containing a filler. The resin is constituted by a first resin disposed in a region surrounded by bump electrodes positioned on the outermost periphery of the semiconductor chip, and by a second resin disposed in a region not surrounded by bump electrodes positioned on the outermost periphery of the semiconductor chip, the first and second resins being distinct from each other in at least one feature selected from a content, a maximum particle diameter and an average particle diameter of the filler.
    Type: Grant
    Filed: January 3, 1996
    Date of Patent: January 26, 1999
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hiroshi Yamada, Takasi Togasaki, Masayuki Saito, Soichi Honma, Miki Mori, Kazuki Tateyama