Patents by Inventor Soichi Kanno

Soichi Kanno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10847350
    Abstract: A heat treatment apparatus includes: a rotation table installed in a vacuum container, the rotation table mounting a substrate in a mounting area formed in one surface side of the rotation table and revolving the substrate; a heater that heats the rotation table; a plasma processing part that generates a plasma in a plasma generation region, which is formed in the one surface side of the rotation table at a region through which the substrate passes, and processes the substrate; a temperature measurement terminal installed in the rotation table at a region, which passes through a position facing the plasma generation region when the rotation table is rotated, the temperature measurement terminal outputting a temperature measurement result of the rotation table as an electric signal; and a conductive plasma shield part installed to cover the temperature measurement terminal when viewed from the plasma generation region.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: November 24, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Soichi Kanno
  • Publication number: 20160177450
    Abstract: A heat treatment apparatus includes: a rotation table installed in a vacuum container, the rotation table mounting a substrate in a mounting area formed in one surface side of the rotation table and revolving the substrate; a heater that heats the rotation table; a plasma processing part that generates a plasma in a plasma generation region, which is formed in the one surface side of the rotation table at a region through which the substrate passes, and processes the substrate; a temperature measurement terminal installed in the rotation table at a region, which passes through a position facing the plasma generation region when the rotation table is rotated, the temperature measurement terminal outputting a temperature measurement result of the rotation table as an electric signal; and a conductive plasma shield part installed to cover the temperature measurement terminal when viewed from the plasma generation region.
    Type: Application
    Filed: December 18, 2015
    Publication date: June 23, 2016
    Inventor: Soichi KANNO
  • Patent number: 8636409
    Abstract: A heat treatment apparatus includes: a furnace body including a heating part; a processing vessel wherein a space having a plurality of regions is formed between the furnace body and the processing vessel; an in-furnace temperature sensor disposed corresponding to each of the plurality of regions in the space; an in-furnace temperature calculating unit configured to calculate an in-furnace temperature based on signals from each of the in-furnace temperature sensors; and a control unit configured to control the heating part based on the in-furnace temperature calculated by the in-furnace temperature calculating unit. The in-furnace temperature sensor disposed in the reference region includes: a first thermocouple formed of an R thermocouple or an S thermocouple; and a second thermocouple formed of a thermocouple other than the R thermocouple or the S thermocouple. The in-furnace temperature sensor disposed in the other region includes the second thermocouple.
    Type: Grant
    Filed: February 17, 2012
    Date of Patent: January 28, 2014
    Assignee: Tokyo Electron Limited
    Inventor: Soichi Kanno
  • Publication number: 20120213249
    Abstract: A heat treatment apparatus includes: a furnace body including a heating part; a processing vessel wherein a space having a plurality of regions is formed between the furnace body and the processing vessel; an in-furnace temperature sensor disposed corresponding to each of the plurality of regions in the space; an in-furnace temperature calculating unit configured to calculate an in-furnace temperature based on signals from each of the in-furnace temperature sensors; and a control unit configured to control the heating part based on the in-furnace temperature calculated by the in-furnace temperature calculating unit. The in-furnace temperature sensor disposed in the reference region includes: a first thermocouple formed of an R thermocouple or an S thermocouple; and a second thermocouple formed of a thermocouple other than the R thermocouple or the S thermocouple. The in-furnace temperature sensor disposed in the other region includes the second thermocouple.
    Type: Application
    Filed: February 17, 2012
    Publication date: August 23, 2012
    Applicant: TOKYO ELECTRON LIMITED
    Inventor: Soichi KANNO
  • Patent number: 5875416
    Abstract: The temperature adjusting apparatus of a heat treatment equipment includes a first temperature sensor, provided close to an object to be treated in a heat treatment furnace of the heat treatment equipment for detecting a treatment temperature of a position close to the object to be treated, a second temperature sensor, provided close to an outer surface of the heat treatment furnace, for detecting a heating temperature of the heat treatment furnace, and a calculation circuit for calculating a target value of the second temperature sensor by subtracting a correction value from a set temperature of the first temperature sensor. Further included is a heat adjustment section for adjusting heating of the heat treatment furnace in accordance with a deviation between the target value of the second temperature sensor and a detection value of the second temperature sensor.
    Type: Grant
    Filed: January 23, 1997
    Date of Patent: February 23, 1999
    Assignee: Tokyo Electron Limited
    Inventor: Soichi Kanno
  • Patent number: 5777881
    Abstract: A method of deciding temperature control parameters of a heat treatment instrument for performing a heat treatment on a target object by increasing a temperature of a heat furnace of the heat treatment instrument, in accordance with the temperature control parameters initialized, obtaining a transfer function of an entire system of the heat treatment instrument, based on a heat treatment temperature of the heat furnace of the heat treatment instrument, obtaining a transfer function of the heat furnace on the basis of the transfer function of the entire system and the temperature control parameters, and obtaining temperature control parameters to be adopted in actual processing, based on a target transfer function of the entire system of the heat treatment instrument and the transfer function of the heat furnace.
    Type: Grant
    Filed: January 22, 1997
    Date of Patent: July 7, 1998
    Assignee: Tokyo Electron Limited
    Inventor: Soichi Kanno